TH235-2-50G-4JAR

TH235-2-50G-4JAR

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TH235-2-50G-4JAR
Description:
NON SILICONE THERMAL PUTTY
Package:
Bottle
Datasheet:
TH235-2-50G-4JAR Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:TH235-2-50G-4JAR
Category:Fans, Thermal Management
Subcategory:Thermal - Adhesives, Epoxies, Greases, Pastes
Manufacturer:Penchem Technologies Sdn Bhd
Packaging:Bottle
Product Status:Active
Type:Non-Silicone Putty
Size / Dimension:50 gram Jar
Usable Temperature Range:5°F ~ 248°F (-15°C ~ 200°C)
Color:Blue
Thermal Conductivity:4.00W/m-K
Features:-
Shelf Life:18 Months
Storage/Refrigeration Temperature:-
In Stock: 8
Stock:
8 Can Ship Immediately
  • Share:
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