TH997-288-192-2.5

TH997-288-192-2.5

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TH997-288-192-2.5
Description:
SOFT SILICONE THERMAL PAD
Package:
Sheet
Datasheet:
TH997-288-192-2.5 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:TH997-288-192-2.5
Category:Fans, Thermal Management
Subcategory:Thermal - Pads, Sheets
Manufacturer:Penchem Technologies Sdn Bhd
Packaging:Sheet
Product Status:Active
Usage:Thermally Conductive
Type:Gap Filler Pad, Sheet
Shape:Rectangular
Outline:288.00mm x 192.00mm
Thickness:0.0984" (2.500mm)
Material:Silicone
Adhesive:Tacky - Both Sides
Backing, Carrier:-
Color:Blue
Thermal Resistivity:-
Thermal Conductivity:2.4W/m-K
In Stock: 0
Stock:
0 Can Ship Immediately
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