159900F00000G

159900F00000G

Images are for reference only
See Product Specifications

159900F00000G
Description:
THER-O-BOND 1500 THERMAL EPOXY
Package:
Bulk
Datasheet:
159900F00000G Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:159900F00000G
Category:Fans, Thermal Management
Subcategory:Thermal - Adhesives, Epoxies, Greases, Pastes
Manufacturer:Aavid, Thermal Division of Boyd Corporation
Packaging:Bulk
Product Status:Active
Type:Epoxy, 2 Part
Size / Dimension:1 qt Bottle
Usable Temperature Range:-94°F ~ 239°F (-70°C ~ 115°C)
Color:Black
Thermal Conductivity:-
Features:-
Shelf Life:18 Months
Storage/Refrigeration Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
GF3500S35-07-60-50CC
GF3500S35-07-60-50CC
Bergquist
LIQUID GAP FILLER THERMAL CONDU
PK404DM-150
PK404DM-150
Shiu Li Technology Co., Ltd.
TWO-PART THERMAL LIQUID GAP FILL
8329TFF-25ML
8329TFF-25ML
MG Chemicals
FAST CURE THERM COND ADH FLOW
21-430SF-001-010M
21-430SF-001-010M
Jones Tech
THRM GREASE SI FREE10CC GY2W/m-K
120-2
120-2
Wakefield-Vette
SILICONE GREASE 2 OZ JAR
NTE424
NTE424
NTE Electronics, Inc
1 OZ HEAT SINK COMPOUND
B-4-NC
B-4-NC
Wakefield-Vette
HARDENER
253G
253G
Aavid, Thermal Division of Boyd Corporation
THERMAL GREASE
TG-PP10-50
TG-PP10-50
t-Global Technology
ONE-PART THERMAL PUTTY 50G POT
TG-NSP35-30CC
TG-NSP35-30CC
t-Global Technology
NON-SILICONE PUTTY 30CC GREY
TG-NSP80-1OZ
TG-NSP80-1OZ
t-Global Technology
NON-SILICONE PUTTY 1OZ GREY
PROHMPROTECT-3500-1.5
PROHMPROTECT-3500-1.5
ProhmTect
ELEC THERM COND PASTE NONSILIC 1
You May Also Be Interested In
CLP-212TG
CLP-212TG
Aavid, Thermal Division of Boyd Corporation
CLIP,212T
HP-CWS-R08-360-N
HP-CWS-R08-360-N
Aavid, Thermal Division of Boyd Corporation
COPPER-WATER HEAT PIPE, ROUND, D
374424B00035G
374424B00035G
Aavid, Thermal Division of Boyd Corporation
HEATSINK BGA W/ADHESIVE TAPE
PF750G
PF750G
Aavid, Thermal Division of Boyd Corporation
HTSK-AL-PF750 REV A-G
M49165B021000G
M49165B021000G
Aavid, Thermal Division of Boyd Corporation
MAX CLIP HEATSINK
579003B00000G
579003B00000G
Aavid, Thermal Division of Boyd Corporation
BOARD LEVEL HEAT SINK
568403B00000
568403B00000
Aavid, Thermal Division of Boyd Corporation
BOARD LEVEL HEAT SINK
584000B03300G
584000B03300G
Aavid, Thermal Division of Boyd Corporation
HEAT SINK
189805F00000
189805F00000
Aavid, Thermal Division of Boyd Corporation
THERM PAD 41.91MMX28.96MM W/ADH
V708-75/2-009
V708-75/2-009
Aavid, Thermal Division of Boyd Corporation
FLUOROCARBON -009 O-RING
S500-70/2-325
S500-70/2-325
Aavid, Thermal Division of Boyd Corporation
SILICONE -325 O-RING
7717-89DAPG
7717-89DAPG
Aavid, Thermal Division of Boyd Corporation
MOUNT CIRCULAR TO18 0.080"