GoodChip

Thermal - Heat Sinks

113301 Items

Mfr Part #	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
HSS04-B20-P318 HEAT SINK, STAMPING, TO-220, 41. CUI Devices	HSS	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular	1.650" (41.91mm)	1.750" (44.45mm)	-	0.380" (9.65mm)	5.9W @ 75°C	5.50°C/W @ 200 LFM	12.79°C/W	Aluminum Alloy	Black Anodized
NTE497 HEATSINK FOR TO-220 NTE Electronics, Inc		Bag	Active	Board Level, Vertical	-	Bolt On and Board Mounts	Rectangular, Fins	0.500" (12.70mm)	1.380" (35.05mm)	-	2.000" (50.80mm)	-	-	9.44°C/W	Aluminum Alloy	Black Anodized
HSB25-282810 HEAT SINK, BGA, 28.5 X 28.5 X 10 CUI Devices	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.122" (28.50mm)	1.122" (28.50mm)	-	0.394" (10.00mm)	4.87W @ 75°C	5.10°C/W @ 200 LFM	15.41°C/W	Aluminum Alloy	Black Anodized
NTE494 HEATSINK FOR TO220 NTE Electronics, Inc		Bag	Active	Top Mount	TO-220	-	Rectangular, Fins	0.750" (19.05mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	-	-	27.30°C/W	Aluminum Alloy	Black Anodized
HSE01-193175 HEAT SINK, EXTRUSION, 19 X 31.5 CUI Devices	HSE	Box	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Angled Fins	0.748" (19.00mm)	0.748" (19.00mm)	-	0.295" (7.50mm)	2.95W @ 75°C	9.20°C/W @ 200 LFM	25.44°C/W	Aluminum Alloy	Blue Anodized
HSS07-C20-P274 HEAT SINK, STAMPING, TO-220, 21. CUI Devices	HSS	Box	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular	0.853" (21.66mm)	0.520" (13.21mm)	-	0.515" (13.08mm)	2.5W @ 75°C	12.60°C/W @ 200 LFM	29.57°C/W	Copper Alloy	Tin
HSB23-232325 HEAT SINK, BGA, 23 X 23 X 25 MM CUI Devices	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.984" (25.00mm)	6.13W @ 75°C	3.80°C/W @ 200 LFM	12.23°C/W	Aluminum Alloy	Black Anodized
HSE05-171933 HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices	HSE	Box	Active	Board Level	TO-218, TO-220	PC Pin	Rectangular, Angled Fins	0.764" (19.40mm)	0.669" (17.00mm)	-	1.280" (32.50mm)	3.98W @ 75°C	6.90°C/W @ 200 LFM	18.83°C/W	Aluminum Alloy	Black Anodized
HSE02-173213 HEAT SINK, EXTRUSION, 17 X 31.9 CUI Devices	HSE	Box	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Angled Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.492" (12.50mm)	3.5W @ 75°C	6.70°C/W @ 200 LFM	21.44°C/W	Aluminum Alloy	Blue Anodized
ATS-PCB1043 HEATSINK TO-3 Advanced Thermal Solutions Inc.		Bulk	Active	Board Level	TO-3	Bolt On	Rhombus	2.507" (63.67mm)	1.867" (47.41mm)	-	1.667" (42.33mm)	-	2.60°C/W @ 200 LFM	7.50°C/W	Aluminum	Black Anodized
ATS-PCB1021 HEATSINK TO-220 DUAL BLACK Advanced Thermal Solutions Inc.		Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.470" (37.34mm)	1.750" (44.45mm)	-	0.380" (9.65mm)	-	3.00°C/W @ 200 LFM	9.60°C/W	Aluminum	Black Anodized
NTE411 HEAT SINK STUD-MOUNT TO5 NTE Electronics, Inc		Bag	Active	Top Mount	TO-5, TO-39	-	Cylindrical	-	0.437" (11.09mm)	0.312" (7.92mm) ID	0.440" (11.18mm)	-	-	-	-	-
ATS-PCB1033 HEATSINK CLIP-ON TO-220 W/TAB Advanced Thermal Solutions Inc.		Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.850" (21.59mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	-	9.00°C/W @ 200 LFM	20.00°C/W	Aluminum	Black Anodized
HSE01-193175P HEAT SINK, EXTRUSION, 19 X 31.5 CUI Devices	HSE	Box	Active	Top Mount	-	Thermal Tape, Adhesive (Included)	Square, Angled Fins	0.748" (19.00mm)	0.748" (19.00mm)	-	0.295" (7.50mm)	2.95W @ 75°C	9.20°C/W @ 200 LFM	25.44°C/W	Aluminum Alloy	Blue Anodized
ATS-PCB1049 HEATSINK TO-220 W/TAB BLACK Advanced Thermal Solutions Inc.		Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.670" (42.42mm)	1.000" (25.40mm)	-	1.000" (25.40mm)	-	4.40°C/W @ 200 LFM	10.00°C/W	Aluminum	Black Anodized
NTE406 HEAT SINK FOR TO-202 CASE NTE Electronics, Inc		Bag	Active	Top Mount	TO-202	Press Fit	-	0.800" (20.32mm)	-	0.300" (7.62mm) OD	0.850" (21.60mm)	-	-	25.00°C/W	Aluminum Alloy	Black Anodized
ATS-PCB1059 HEATSINK TO-220 COPPER W/TAB Advanced Thermal Solutions Inc.		Bulk	Active	Board Level, Vertical	TO-220	Bolt On and Board Mounts	Rectangular, Fins	1.250" (31.75mm)	0.875" (22.22mm)	-	0.250" (6.35mm)	-	8.80°C/W @ 200 LFM	24.00°C/W	Copper	Tin
ATS-PCB1058 HEATSINK TO-220 COPPER W/TAB Advanced Thermal Solutions Inc.		Bulk	Active	Board Level, Vertical	TO-220	Bolt On and Board Mounts	Rectangular, Fins	1.250" (31.75mm)	0.875" (22.22mm)	-	0.250" (6.35mm)	-	8.80°C/W @ 200 LFM	24.00°C/W	Copper	Tin
HSE06-503045 HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices	HSE	Bag	Active	Board Level	TO-218, TO-220	Clip	Rectangular, Fins	1.969" (50.00mm)	1.181" (30.00mm)	-	1.772" (45.00mm)	12.79W @ 75°C	2.10°C/W @ 200 LFM	5.86°C/W	Aluminum Alloy	Black Anodized
NTE498 HEATSINK FOR PLASTIC PWR NTE Electronics, Inc		Bag	Active	Top Mount	-	Bolt On	Rectangular, Fins	1.500" (38.10mm)	0.500" (12.70mm)	-	1.375" (34.93mm)	-	-	10.40°C/W	Aluminum Alloy	Black Anodized