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See Product Specifications
| Part Number: | HSB23-232325 |
| Category: | Fans, Thermal Management |
| Subcategory: | Thermal - Heat Sinks |
| Manufacturer: | CUI Devices |
| Packaging: | Box |
| Product Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Adhesive |
| Shape: | Square, Pin Fins |
| Length: | 0.906" (23.00mm) |
| Width: | 0.906" (23.00mm) |
| Diameter: | - |
| Fin Height: | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | 6.13W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 3.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 12.23°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
