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Thermal - Heat Sinks

113301 Items

Mfr Part #	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
HSE-B20250-040H-01 HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	HSE	Box	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Angled Fins	0.984" (25.00mm)	1.359" (34.50mm)	-	0.492" (12.50mm)	5.5W @ 75°C	4.44°C/W @ 200 LFM	13.64°C/W	Aluminum Alloy	Black Anodized
6022BG HEATSINK TO-220 STAGGERED FIN Aavid, Thermal Division of Boyd Corporation		Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.210" (30.73mm)	0.875" (22.22mm)	-	0.250" (6.35mm)	2.0W @ 40°C	6.00°C/W @ 400 LFM	16.70°C/W	Aluminum	Black Anodized
501200B00000G HEATSINK 14-16 DIP BLACK .19" Aavid, Thermal Division of Boyd Corporation		Bag	Active	Top Mount	14-DIP and 16-DIP	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	0.250" (6.35mm)	0.731" (18.57mm)	-	0.190" (4.83mm)	0.4W @ 30°C	50.00°C/W @ 200 LFM	68.00°C/W	Aluminum	Black Anodized
HSB10-232306 HEAT SINK, BGA, 23 X 23 X 6 MM CUI Devices	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.236" (6.00mm)	3.0W @ 75°C	9.60°C/W @ 200 LFM	25.46°C/W	Aluminum Alloy	Black Anodized
7020BG HEATSINK TO-220 FOLD 42.16MM Aavid, Thermal Division of Boyd Corporation		Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.450" (36.83mm)	1.300" (33.02mm)	-	0.470" (11.94mm)	8.0W @ 70°C	4.00°C/W @ 500 LFM	8.70°C/W	Aluminum	Black Anodized
573400D00000G BOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation		Bulk	Active	Top Mount	TO-268 (D³Pak)	SMD Pad	Rectangular, Fins	0.500" (12.70mm)	1.220" (30.99mm)	-	0.401" (10.20mm)	1.0W @ 20°C	4.00°C/W @ 600 LFM	14.00°C/W	-	Tin
591302B02800G HEATSINK TO-220 W/INSTALL TAB Aavid, Thermal Division of Boyd Corporation		Bulk	Active	Board Level, Vertical	TO-220, TO-262	Clip and Board Locks	Rectangular, Fins	0.750" (19.05mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 30°C	7.00°C/W @ 400 LFM	26.80°C/W	Aluminum	Black Anodized
523002B00000G HEATSINK TO-220 W/TAB BLACK Aavid, Thermal Division of Boyd Corporation		Bag	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	1.0W @ 20°C	6.00°C/W @ 300 LFM	13.60°C/W	Aluminum	Black Anodized
HSB08-212106 HEAT SINK, BGA, 21 X 21 X 6 MM CUI Devices	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.236" (6.00mm)	3.0W @ 75°C	9.70°C/W @ 200 LFM	25.40°C/W	Aluminum Alloy	Black Anodized
HSS10-B20-P40 HEAT SINK, STAMPING, TO-220, 29. CUI Devices	HSS	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	4.1W @ 75°C	7.90°C/W @ 200 LFM	18.12°C/W	Aluminum Alloy	Black Anodized
HSB03-121218 HEAT SINK, BGA, 12 X 12 X 18 MM CUI Devices	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	0.472" (12.00mm)	0.472" (12.00mm)	-	0.709" (18.00mm)	3.1W @ 75°C	9.60°C/W @ 200 LFM	24.01°C/W	Aluminum Alloy	Black Anodized
ATS-PCB1065 HEATSINK TO-220 CLIP-ON BLACK Advanced Thermal Solutions Inc.		Bulk	Active	Board Level	TO-220	Clip	Rectangular, Fins	0.748" (19.00mm)	0.504" (12.80mm)	-	0.500" (12.70mm)	-	10.20°C/W @ 200 LFM	27.30°C/W	Aluminum	Black Anodized
HSB09-212115 HEAT SINK, BGA, 21 X 21 X 15 MM CUI Devices	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.591" (15.00mm)	4.3W @ 75°C	6.00°C/W @ 200 LFM	17.39°C/W	Aluminum Alloy	Black Anodized
507222B05300G HEAT SINK Aavid, Thermal Division of Boyd Corporation	Hat Section 5070	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.375" (9.53mm)	1.750" (44.45mm)	-	1.470" (37.34mm)	-	-	-	Aluminum	Black Anodized
530614B00000G HEATSINK TO-220 4.5W H=.5" BLK Aavid, Thermal Division of Boyd Corporation		Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	4.0W @ 80°C	6.00°C/W @ 600 LFM	16.70°C/W	Aluminum	Black Anodized
ATS-PCB1009 HEATSINK TO-220 LOW PROFILE Advanced Thermal Solutions Inc.		Bulk	Active	Board Level	TO-220	Bolt On	Square, Fins	0.750" (19.05mm)	0.750" (19.05mm)	-	0.375" (9.52mm)	-	10.00°C/W @ 200 LFM	24.00°C/W	Aluminum	Black Anodized
658-25AB HEATSINK CPU 28MM SQ BLK Wakefield-Vette	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
ATS-PCB1024 HEATSINK TO-220 BLACK Advanced Thermal Solutions Inc.		Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	-	11.00°C/W @ 200 LFM	16.70°C/W	Aluminum	Black Anodized
HSB18-232310 HEAT SINK, BGA, 23 X 23 X 10 MM CUI Devices	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.394" (10.00mm)	3.7W @ 75°C	6.80°C/W @ 200 LFM	20.41°C/W	Aluminum Alloy	Black Anodized
508500B00000G HEATSINK 24-PIN DIP GLUE-ON BLK Aavid, Thermal Division of Boyd Corporation		Bag	Active	Top Mount	24-DIP	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	1.250" (31.75mm)	0.530" (13.46mm)	-	0.190" (4.83mm)	1.0W @ 40°C	15.00°C/W @ 500 LFM	34.00°C/W	Aluminum	Black Anodized