HSB08-212106

HSB08-212106

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See Product Specifications

HSB08-212106
Mfr.:
Description:
HEAT SINK, BGA, 21 X 21 X 6 MM
Package:
Box
Datasheet:
HSB08-212106 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:HSB08-212106
Category:Fans, Thermal Management
Subcategory:Thermal - Heat Sinks
Manufacturer:CUI Devices
Packaging:Box
Product Status:Active
Type:Top Mount
Package Cooled:BGA
Attachment Method:Adhesive
Shape:Square, Pin Fins
Length:0.827" (21.00mm)
Width:0.827" (21.00mm)
Diameter:-
Fin Height:0.236" (6.00mm)
Power Dissipation @ Temperature Rise:3.0W @ 75°C
Thermal Resistance @ Forced Air Flow:9.70°C/W @ 200 LFM
Thermal Resistance @ Natural:25.40°C/W
Material:Aluminum Alloy
Material Finish:Black Anodized
In Stock: 0
Stock:
0 Can Ship Immediately
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For Use With
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