PDF |
Mfr Part # |
RFQ |
Series |
Packaging |
Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature |
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Smooth Flow™ |
Bulk |
Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 4 | - | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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SMD2 |
Bulk |
Active | Solder Sphere | Sn63Pb37 (63/37) | 0.030" (0.76mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
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Bag |
Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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SMD2 |
Bulk |
Active | Solder Sphere | Sn63Pb37 (63/37) | 0.025" (0.64mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
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Cartridge |
Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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Cartridge |
Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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SMD2 |
Bulk |
Active | Solder Sphere | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
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WS300 |
Bulk |
Not For New Designs | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | - | Lead Free | Syringe, 2.65 oz (75g) | 6 Months | Date of Manufacture | 35.6°F ~ 46.4°F (2°C ~ 8°C) |
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WS300 |
Bulk |
Not For New Designs | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | - | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 35.6°F ~ 46.4°F (2°C ~ 8°C) |
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Bag |
Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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Bulk |
Active | Wire Solder | Sn63Pb37 (63/37) | 0.040" (1.02mm) | 361°F (183°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
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Cartridge |
Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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Cartridge |
Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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SMD2 |
Bulk |
Active | Solder Sphere | Sn63Pb37 (63/37) | 0.012" (0.31mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
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CHIPQUIK® |
Bulk |
Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | - |
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Bag |
Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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4900 |
Bulk |
Active | Solder Paste | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | - | 423 ~ 430°F (217 ~ 221°C) | No-Clean | - | - | Lead Free | Jar, 8.8 oz (250g) | 24 Months | Date of Manufacture | 35°F ~ 50°F (2°C ~ 10°C) |
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Jar |
Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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Cartridge |
Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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Cartridge |
Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 3 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |