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See Product Specifications
| Part Number: | 4900P-250G |
| Category: | Soldering, Desoldering, Rework Products |
| Subcategory: | Solder |
| Manufacturer: | MG Chemicals |
| Packaging: | Bulk |
| Product Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) |
| Diameter: | - |
| Melting Point: | 423 ~ 430°F (217 ~ 221°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Mesh Type: | - |
| Process: | Lead Free |
| Form: | Jar, 8.8 oz (250g) |
| Shelf Life: | 24 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 35°F ~ 50°F (2°C ~ 10°C) |
