GoodChip

Solder

1543 Items

Mfr Part #	Series	Packaging	Product Status	Type	Composition	Diameter	Melting Point	Flux Type	Wire Gauge	Mesh Type	Process	Form	Shelf Life	Shelf Life Start	Storage/Refrigeration Temperature
NCSWLF.020 1LB LF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc.		Bulk	Active	Wire Solder	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.020" (0.51mm)	422 ~ 428°F (217 ~ 220°C)	No-Clean	24 AWG, 25 SWG	-	Lead Free	Spool, 1 lb (454 g)	-	-	-
SMD2180 SOLDER SPHERES SN63/PB37 .016" ( Chip Quik Inc.	SMD2	Bulk	Active	Solder Sphere	Sn63Pb37 (63/37)	0.016" (0.40mm)	361°F (183°C)	-	-	-	Leaded	Jar	24 Months	Date of Manufacture	-
96-9574-9520 K100LD 3.3%/268 .020 500 G ROBO Kester Solder	268	Bulk	Active	Wire Solder	Sn99.3Cu0.7 (99.3/0.7)	0.020" (0.51mm)	441°F (227°C)	No-Clean	24 AWG, 25 SWG	-	Lead Free	Spool, 17.64 oz (500g)	-	-	50°F ~ 104°F (10°C ~ 40°C)
RASWLF.020 1LB LF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc.		Bulk	Active	Wire Solder	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.020" (0.51mm)	422 ~ 428°F (217 ~ 220°C)	Rosin Activated (RA)	24 AWG, 25 SWG	-	Lead Free	Spool, 1 lb (454 g)	-	-	-
SMDSWLF.015 1LB LF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc.		Bulk	Active	Wire Solder	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.015" (0.38mm)	423 ~ 428°F (217 ~ 220°C)	No-Clean, Water Soluble	27 AWG, 28 SWG	-	Lead Free	Spool, 1 lb (454 g)	-	-	-
RASWLF.015 1LB LF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc.		Bulk	Active	Wire Solder	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.015" (0.38mm)	422 ~ 428°F (217 ~ 220°C)	Rosin Activated (RA)	27 AWG, 28 SWG	-	Lead Free	Spool, 1 lb (454 g)	-	-	-
SMD2170 SOLDER SPHERES SN63/PB37 .014" ( Chip Quik Inc.	SMD2	Bulk	Active	Solder Sphere	Sn63Pb37 (63/37)	0.014" (0.36mm)	361°F (183°C)	-	-	-	Leaded	Jar	24 Months	Date of Manufacture	-
SMD291SNL50T6 SOLDER PASTE IN JAR 50G (T6) SAC Chip Quik Inc.	SMD	Bulk	Active	Solder Paste	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	-	422 ~ 428°F (217 ~ 220°C)	No-Clean	-	6	Lead Free	Jar, 1.76 oz (50g)	6 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)
SMD2150 SOLDER SPHERES SN63/PB37 .010" ( Chip Quik Inc.	SMD2	Bulk	Active	Solder Sphere	Sn63Pb37 (63/37)	0.010" (0.25mm)	361°F (183°C)	-	-	-	Leaded	Jar	24 Months	Date of Manufacture	-
SMD2140 SOLDER SPHERES SN63/PB37 .008" ( Chip Quik Inc.	SMD2	Bulk	Active	Solder Sphere	Sn63Pb37 (63/37)	0.008" (0.20mm)	361°F (183°C)	-	-	-	Leaded	Jar	24 Months	Date of Manufacture	-
TS391SNL500C THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc.		Bulk	Active	Solder Paste	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	-	423 ~ 428°F (217 ~ 220°C)	No-Clean	-	4	Lead Free	Cartridge, 17.64 oz (500g)	12 Months	Date of Manufacture	68°F ~ 77°F (20°C ~ 25°C)
SMD2040 SOLDER SPHERES SAC305 .020 DIAM Chip Quik Inc.	SMD2	Bulk	Active	Solder Sphere	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.020" (0.51mm)	423 ~ 428°F (217 ~ 220°C)	-	-	-	Lead Free	Jar	24 Months	Date of Manufacture	-
SMD2036 SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc.	SMD2	Bulk	Active	Solder Sphere	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.018" (0.46mm)	423 ~ 428°F (217 ~ 220°C)	-	-	-	Lead Free	Jar	24 Months	Date of Manufacture	-
SMD2032 SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc.	SMD2	Bulk	Active	Solder Sphere	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.016" (0.40mm)	423 ~ 428°F (217 ~ 220°C)	-	-	-	Lead Free	Jar	24 Months	Date of Manufacture	-
SMD2028 SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc.	SMD2	Bulk	Active	Solder Sphere	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.014" (0.36mm)	423 ~ 428°F (217 ~ 220°C)	-	-	-	Lead Free	Jar	24 Months	Date of Manufacture	-
SMD2020 SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc.	SMD2	Bulk	Active	Solder Sphere	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.010" (0.25mm)	423 ~ 428°F (217 ~ 220°C)	-	-	-	Lead Free	Jar	24 Months	Date of Manufacture	-
SMD2016 SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc.	SMD2	Bulk	Active	Solder Sphere	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.008" (0.20mm)	423 ~ 428°F (217 ~ 220°C)	-	-	-	Lead Free	Jar	24 Months	Date of Manufacture	-
SMDLTLFP500T3C SOLDER PASTE LOW TEMP T3 500G Chip Quik Inc.		Cartridge	Active	Solder Paste	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	-	281°F (138°C)	No-Clean	-	3	Lead Free	Cartridge, 17.64 oz (500g)	6 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)
70-1002-0510 SOLDER 500G JAR, SN63/PB37 Kester Solder	HydroMark 531	Jar	Active	Solder Paste	Sn63Pb37 (63/37)	-	361°F (183°C)	Water Soluble	-	3	Leaded	Jar, 17.64 oz (500g)	6 Months	Date of Manufacture	32°F ~ 50°F (0°C ~ 10°C)
70-4102-0610 SOLDER PASTE NO CLEAN 500GM Kester Solder	NP545	Bulk	Active	Solder Paste	Sn63Pb37 (63/37)	-	361°F (183°C)	No-Clean	-	4	Leaded	Jar, 17.64 oz (500g)	12 Months	Date of Manufacture	32°F ~ 50°F (0°C ~ 10°C)