TS391SNL500C

TS391SNL500C

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See Product Specifications

TS391SNL500C
Description:
THERMALLY STABLE SOLDER PASTE NO
Package:
Bulk
Datasheet:
TS391SNL500C Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:TS391SNL500C
Category:Soldering, Desoldering, Rework Products
Subcategory:Solder
Manufacturer:Chip Quik Inc.
Packaging:Bulk
Product Status:Active
Type:Solder Paste
Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter:-
Melting Point:423 ~ 428°F (217 ~ 220°C)
Flux Type:No-Clean
Wire Gauge:-
Mesh Type:4
Process:Lead Free
Form:Cartridge, 17.64 oz (500g)
Shelf Life:12 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:68°F ~ 77°F (20°C ~ 25°C)
In Stock: 4
Stock:
4 Can Ship Immediately
  • Share:
For Use With
70-1607-0520
70-1607-0520
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24-6040-9703
24-6040-9703
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CC6001031
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60SN/40PB WATER SOLUBLE FLUX 1 L
WC6301020P
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24-7050-0007
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Chip Quik Inc.
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14-6337-0125
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24-6337-9758
24-6337-9758
Kester Solder
SOLDER FLUX-CORED/285 63/37 .032
24-7040-0026
24-7040-0026
Kester Solder
SOLDER FLUX-CORED/44 .031" 1LB S
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