3-1571550-0

3-1571550-0

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3-1571550-0
Description:
CONN IC DIP SOCKET 32POS GOLD
Package:
Tube
Datasheet:
3-1571550-0 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:3-1571550-0
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:TE Connectivity AMP Connectors
Packaging:Tube
Product Status:Active
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):32 (2 x 16)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:25.0µin (0.63µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:25.0µin (0.63µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:-55°C ~ 125°C
In Stock: 704
Stock:
704 Can Ship Immediately
  • Share:
For Use With
110-99-308-41-001000
110-99-308-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 8POS TIN-LEAD
110-87-628-41-105101
110-87-628-41-105101
Preci-Dip
CONN IC DIP SOCKET 28POS GOLD
317-47-114-41-005000
317-47-114-41-005000
Mill-Max Manufacturing Corp.
STANDRD SOLDRTL SNG SKT
317-93-111-41-005000
317-93-111-41-005000
Mill-Max Manufacturing Corp.
CONN SKT SNG
30-6822-90C
30-6822-90C
Aries Electronics
CONN IC DIP SOCKET 30POS GOLD
116-47-650-41-006000
116-47-650-41-006000
Mill-Max Manufacturing Corp.
STANDRD SOLDRTL
18-822-90EWR
18-822-90EWR
Aries Electronics
CONN IC DIP SOCKET 18POS TIN
510-91-256-19-081002
510-91-256-19-081002
Mill-Max Manufacturing Corp.
SOCKET SOLDERTAIL 256-PGA
SIP050-1X29-157BLF
SIP050-1X29-157BLF
Amphenol ICC (FCI)
CONN SOCKET SIP 29POS TIN
515-13-085-13-042002
515-13-085-13-042002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
515-91-159-16-105002
515-91-159-16-105002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
515-93-145-15-002002
515-93-145-15-002002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
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