SIP050-1X29-157BLF

SIP050-1X29-157BLF

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SIP050-1X29-157BLF
Description:
CONN SOCKET SIP 29POS TIN
Package:
Bulk
Datasheet:
SIP050-1X29-157BLF Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:SIP050-1X29-157BLF
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Amphenol ICC (FCI)
Packaging:Bulk
Product Status:Obsolete
Type:SIP
Number of Positions or Pins (Grid):29 (1 x 29)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:200.0µin (5.08µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
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