TH930-500G-JAR

TH930-500G-JAR

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TH930-500G-JAR
Description:
SILICONE THERMAL PUTTY
Package:
Bottle
Datasheet:
TH930-500G-JAR Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:TH930-500G-JAR
Category:Fans, Thermal Management
Subcategory:Thermal - Adhesives, Epoxies, Greases, Pastes
Manufacturer:Penchem Technologies Sdn Bhd
Packaging:Bottle
Product Status:Active
Type:Silicone Putty
Size / Dimension:500 gram Container
Usable Temperature Range:-76°F ~ 392°F (-60°C ~ 200°C)
Color:White
Thermal Conductivity:5.00W/m-K
Features:-
Shelf Life:18 Months
Storage/Refrigeration Temperature:-
In Stock: 1
Stock:
1 Can Ship Immediately
  • Share:
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