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See Product Specifications
| Part Number: | SMDSWLF.059 3.3 1LB |
| Category: | Soldering, Desoldering, Rework Products |
| Subcategory: | Solder |
| Manufacturer: | Chip Quik Inc. |
| Packaging: | Bulk |
| Product Status: | Active |
| Type: | Wire Solder |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | 0.059" (1.50mm) |
| Melting Point: | 423 ~ 428°F (217 ~ 220°C) |
| Flux Type: | No-Clean, Water Soluble |
| Wire Gauge: | - |
| Mesh Type: | - |
| Process: | Lead Free |
| Form: | Spool, 1 lb (453.59g) |
| Shelf Life: | - |
| Shelf Life Start: | - |
| Storage/Refrigeration Temperature: | - |
