PA0170-S

PA0170-S

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See Product Specifications

PA0170-S
Description:
MINI SOIC-8 EXP PAD STENCIL
Package:
Bulk
Datasheet:
PA0170-S Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:PA0170-S
Category:Soldering, Desoldering, Rework Products
Subcategory:Solder Stencils, Templates
Manufacturer:Chip Quik Inc.
Packaging:Bulk
Product Status:Active
Type:Mini SOIC
Number of Positions:8
Pitch:0.026" (0.65mm)
Outer Dimension:1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension:0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad:0.315" L x 0.067" W (8.00mm x 1.70mm)
Material:Stainless Steel
In Stock: 0
Stock:
0 Can Ship Immediately
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