BGA0030-S

BGA0030-S

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See Product Specifications

BGA0030-S
Description:
BGA-36 (0.5 MM PITCH, 6 X 6 GRID
Package:
Bulk
Datasheet:
BGA0030-S Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:BGA0030-S
Category:Soldering, Desoldering, Rework Products
Subcategory:Solder Stencils, Templates
Manufacturer:Chip Quik Inc.
Packaging:Bulk
Product Status:Active
Type:BGA
Number of Positions:36
Pitch:0.020" (0.50mm)
Outer Dimension:1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension:-
Thermal Center Pad:-
Material:Stainless Steel
In Stock: 5
Stock:
5 Can Ship Immediately
  • Share:
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