Thermal - Heat Sinks
113301 Items
PDF Mfr Part # RFQ Series Packaging Product StatusTypePackage CooledAttachment MethodShapeLengthWidthDiameterFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterialMaterial Finish
7106DG
7106DG
BOARD LEVEL HEATSINK .375" D2PAK
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveTop MountTO-263 (D²Pak), PowerSO-10 (MO-184), SO-10SMD PadRectangular, Fins0.591" (15.00mm)1.020" (25.91mm)-0.375" (9.52mm)2.0W @ 40°C5.00°C/W @ 400 LFM-CopperTin
529702B02500G
529702B02500G
BOARD LEVEL HEATSINK 1" TO-220
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins1.000" (25.40mm)1.650" (41.91mm)-1.000" (25.40mm)4.0W @ 30°C4.00°C/W @ 200 LFM5.50°C/WAluminumBlack Anodized
593101B03600G
593101B03600G
HEATSINK TO-218/TO-247 TAB
Aavid, Thermal Division of Boyd Corporation
Tray ActiveBoard Level, VerticalTO-218, TO-247Bolt On and PC PinRectangular, Fins1.640" (41.66mm)1.700" (43.18mm)-0.500" (12.70mm)6.0W @ 50°C4.00°C/W @ 300 LFM8.60°C/WAluminumBlack Anodized
573100D00000G
573100D00000G
TOP MOUNT HEATSINK .4" D-PAK
Aavid, Thermal Division of Boyd Corporation
5731 Bulk ActiveTop MountTO-252 (DPak)SMD PadRectangular, Fins0.315" (8.00mm)0.900" (22.86mm)-0.400" (10.16mm)0.8W @ 30°C12.50°C/W @ 600 LFM15.00°C/WAluminumTin
624-25ABT4E
624-25ABT4E
HEATSINK CPU 21MM SQ W/DBL TAPE
Wakefield-Vette
624 Bulk ActiveTop MountBGAThermal Tape, Adhesive (Included)Square, Pin Fins0.827" (21.00mm)0.827" (21.00mm)-0.250" (6.35mm)-25.00°C/W @ 200 LFM-AluminumBlack Anodized
7019B-MTG
7019B-MTG
HEATSINK TO-220 TAB FOLD 25.4MM
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins1.000" (25.40mm)1.550" (39.37mm)-0.375" (9.52mm)3.0W @ 40°C8.00°C/W @ 100 LFM11.00°C/WAluminumBlack Anodized
7021B-MTG
7021B-MTG
HEATSINK TO-220 TAB FOLD 42.16MM
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins1.450" (36.83mm)1.750" (44.45mm)-0.380" (9.65mm)6.0W @ 50°C4.00°C/W @ 300 LFM6.80°C/WAluminumBlack Anodized
RA-T2X-25E
RA-T2X-25E
HEATSINK TO-218,TO-220,TO-247
Ohmite
R Box ActiveBoard Level, VerticalTO-218, TO-220, TO-247Bolt On and PC PinRectangular, Fins1.654" (42.00mm)0.985" (25.00mm)-1.000" (25.40mm)2.0W @ 20°C1.50°C/W @ 200 LFM4.80°C/WAluminumBlack Anodized
533002B02551G
533002B02551G
HEATSINK TO-220 SOLDERPIN/CLIP
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard Level, VerticalTO-220Clip and PC PinRectangular, Fins1.000" (25.40mm)1.375" (34.93mm)-0.500" (12.70mm)2.0W @ 30°C4.00°C/W @ 400 LFM13.00°C/WAluminumBlack Anodized
578622B03200G
578622B03200G
HEATSINK TO-220 DUAL MNT W/TABS
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard Level, VerticalTO-220 (Dual)Bolt On and PC PinRectangular, Fins1.000" (25.40mm)1.480" (37.59mm)-0.500" (12.70mm)2.0W @ 30°C3.00°C/W @ 700 LFM13.20°C/WAluminumBlack Anodized
625-25ABT4E
625-25ABT4E
HEATSINK CPU 25MM SQ W/DBL TAPE
Wakefield-Vette
625 Bulk ActiveTop MountBGAThermal Tape, Adhesive (Included)Square, Pin Fins0.984" (25.00mm)0.984" (25.00mm)-0.250" (6.35mm)-12.00°C/W @ 500 LFM-AluminumBlack Anodized
581102B02500G
581102B02500G
HEATSINK TO-220 2.5W BLK W/PINS
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins1.500" (38.10mm)0.640" (16.26mm)-0.640" (16.26mm)3.0W @ 50°C5.00°C/W @ 200 LFM16.80°C/WAluminumBlack Anodized
WA-T220-101E
WA-T220-101E
HEATSINK AND CLIP FOR TO-220 BLK
Ohmite
W Tray ActiveBoard Level, VerticalTO-220Clip and PC PinRectangular, Fins1.201" (30.50mm)0.720" (18.29mm)-0.630" (16.00mm)1.0W @ 20°C-12.00°C/WAluminumBlack Anodized
RA-T2X-38E
RA-T2X-38E
HEATSINK TO-220,TO-218,TO-247
Ohmite
R Box ActiveBoard Level, VerticalTO-218, TO-220, TO-247Bolt On and PC PinRectangular, Fins1.654" (42.00mm)0.985" (25.00mm)-1.500" (38.10mm)14.0W @ 70°C1.00°C/W @ 400 LFM3.90°C/WAluminumBlack Anodized
658-60ABT1E
658-60ABT1E
HEATSINK CPU 28MM SQ BLK W/TAPE
Wakefield-Vette
658 Bulk ActiveTop MountBGAThermal Tape, Adhesive (Included)Square, Pin Fins1.100" (27.94mm)1.100" (27.94mm)-0.600" (15.24mm)2.5W @ 30°C2.00°C/W @ 500 LFM-AluminumBlack Anodized
6043BG
6043BG
HEATSINK TO-220 LOCKING TAB CLIP
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard LevelTO-220ClipRectangular0.800" (20.32mm)0.268" (6.81mm)-1.000" (25.40mm)1.5W @ 40°C4.00°C/W @ 500 LFM23.00°C/WAluminumBlack Anodized
ATS-CPX025025010-137-C1-R0
ATS-CPX025025010-137-C1-R0
HEATSINK 25X25X10MM L-TAB CP
Advanced Thermal Solutions Inc.
pushPIN™ Tray ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Push PinSquare, Fins0.984" (25.00mm)0.984" (25.00mm)-0.394" (10.00mm)-18.29°C/W @ 100 LFM-AluminumBlue Anodized
BDN09-3CB/A01
BDN09-3CB/A01
HEATSINK CPU W/ADHESIVE .91"SQ
CTS Thermal Management Products
BDN Box ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Thermal Tape, Adhesive (Included)Square, Pin Fins0.910" (23.11mm)0.910" (23.11mm)-0.355" (9.02mm)-9.60°C/W @ 400 LFM26.90°C/WAluminumBlack Anodized
6400BG
6400BG
BOARD LEVEL HEAT SINK
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard Level, VerticalTO-218, TO-220, TO-247, MultiwattBolt On and PC PinRectangular, Fins1.650" (41.91mm)1.000" (25.40mm)-2.500" (63.50mm)4.0W @ 20°C1.50°C/W @ 400 LFM2.70°C/WAluminumBlack Anodized
WA-T247-101E
WA-T247-101E
HEATSINK AND CLIP FOR TO-247 BLK
Ohmite
W Tray ActiveBoard Level, VerticalTO-247Clip and PC PinRectangular, Fins1.260" (32.00mm)0.921" (23.40mm)-0.630" (16.00mm)1.0W @ 20°C8.00°C/W @ 500 LFM7.00°C/WAluminumBlack Anodized