Thermal - Heat Sinks
113301 Items
PDF Mfr Part # RFQ Series Packaging Product StatusTypePackage CooledAttachment MethodShapeLengthWidthDiameterFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterialMaterial Finish
960-19-33-F-AB-0
960-19-33-F-AB-0
HEATSINK 19X33MM FRONT PUSH PIN
Wakefield-Vette
960 Box ActiveTop MountBGAPush PinSquare, Pin Fins0.748" (19.00mm)0.748" (19.00mm)-1.299" (33.00mm)---AluminumBlack Anodized
APF30-30-06CB
APF30-30-06CB
HEATSINK LOW-PROFILE FORGED
CTS Thermal Management Products
APF Box ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Thermal Tape, Adhesive (Not Included)Square, Fins1.181" (30.00mm)1.181" (30.00mm)-0.250" (6.35mm)-4.40°C/W @ 200 LFM-AluminumBlack Anodized
960-19-28-F-AB-0
960-19-28-F-AB-0
HEATSINK 19X28MM FRONT PUSH PIN
Wakefield-Vette
960 Box ActiveTop MountBGAPush PinSquare, Pin Fins0.748" (19.00mm)0.748" (19.00mm)-1.102" (28.00mm)-4.00°C/W @ 200 LFM-AluminumBlack Anodized
ATS-CPX045045030-163-C2-R0
ATS-CPX045045030-163-C2-R0
HEATSINK 45X45X30MM L-TAB CP
Advanced Thermal Solutions Inc.
pushPIN™ Bulk ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Push PinSquare, Fins1.772" (45.00mm)1.772" (45.00mm)-1.181" (30.00mm)-2.90°C/W @ 100 LFM-AluminumBlue Anodized
PV-T21-38E
PV-T21-38E
DUAL PIN FIN HEATSINK 1 CLIP
Ohmite
P Box ActiveBoard Level, VerticalTO-220, TO-247, TO-264Clip and PC PinRectangular, Pin Fins2.170" (55.12mm)1.240" (31.50mm)-1.520" (38.61mm)--3.89°C/WAluminumDegreased
960-31-12-S-AB-0
960-31-12-S-AB-0
HEATSINK 31X12MM SIDE PUSH PIN
Wakefield-Vette
960 Tray ActiveTop MountBGAPush PinSquare, Pin Fins1.220" (31.00mm)1.220" (31.00mm)-0.472" (12.00mm)-5.00°C/W @ 200 LFM-AluminumBlack Anodized
OMNI-220-18-25-1C
OMNI-220-18-25-1C
HEATSINK 18X25MM 1-CLIP TO-220
Wakefield-Vette
OmniKlip™ Tray ActiveBoard Level, VerticalTO-220Clip, Solder FootRectangular, Fins0.984" (25.00mm)0.710" (18.03mm)-1.500" (38.10mm)---AluminumBlack Anodized
335824B00034G
335824B00034G
HEATSINK BGA W/ADHESIVE TAPE
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveTop MountBGAThermal Tape, Adhesive (Included)Square, Pin Fins1.180" (29.97mm)1.180" (29.97mm)-0.370" (9.40mm)2.0W @ 60°C9.10°C/W @ 200 LFM29.40°C/WAluminumBlack Anodized
505403B00000G
505403B00000G
HEATSINK TO-3 H31.75MM
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard LevelTO-3Bolt OnSquare, Pin Fins1.780" (45.21mm)1.780" (45.21mm)-1.250" (31.75mm)7.0W @ 40°C1.50°C/W @ 600 LFM6.00°C/WAluminumBlack Anodized
APR27-27-12CB/A01
APR27-27-12CB/A01
HEATSINK FORGED W/THERMAL TAPE
CTS Thermal Management Products
APR Box ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Thermal Tape, Adhesive (Included)Square, Pin Fins1.047" (26.60mm)1.047" (26.60mm)-0.457" (11.60mm)-5.30°C/W @ 200 LFM-AluminumBlack Anodized
501603B00000G
501603B00000G
HEAT SINK TO-3 1.25" COMPACT
Aavid, Thermal Division of Boyd Corporation
Tray ActiveBoard LevelTO-3Bolt OnRhombus1.880" (47.75mm)1.400" (35.56mm)-1.250" (31.75mm)4.0W @ 30°C3.00°C/W @ 200 LFM7.80°C/WAluminumBlack Anodized
374724B60024G
374724B60024G
HEATSINK BGA W/O SOLDER ANCHORS
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveTop MountBGASolder AnchorSquare, Pin Fins1.378" (35.00mm)1.378" (35.00mm)-0.709" (18.00mm)3.0W @ 50°C5.20°C/W @ 200 LFM15.30°C/WAluminumBlack Anodized
ATS-06C-152-C2-R0
ATS-06C-152-C2-R0
HEATSINK 35X35X35MM L-TAB T766
Advanced Thermal Solutions Inc.
pushPIN™ Tray ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Push PinSquare, Fins1.378" (35.00mm)1.378" (35.00mm)-1.378" (35.00mm)-3.32°C/W @ 100 LFM-AluminumBlue Anodized
OMNI-UNI-30-75-D
OMNI-UNI-30-75-D
HEATSINK TO-247 TO-264 TO-220
Wakefield-Vette
OmniKlip™ Bulk ActiveBoard Level, VerticalTO-220, TO-247, TO-264Clip, Solder FootRectangular, Fins2.953" (75.00mm)1.181" (30.00mm)-2.362" (60.00mm)---AluminumBlack Anodized
901-19-1-23-2-B-0
901-19-1-23-2-B-0
HEATSINK 19X19X23MM ELLIPTICAL
Wakefield-Vette
901 Box ActiveTop MountBGAPush PinSquare, Pin Fins0.748" (19.00mm)0.748" (19.00mm)-0.892" (22.65mm)-4.90°C/W @ 200 LFM12.00°C/WAluminumBlack Anodized
PF750G
PF750G
HTSK-AL-PF750 REV A-G
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard Level, VerticalTO-220Clip and PC PinRectangular0.866" (22.00mm)0.433" (11.00mm)-0.748" (19.00mm)---AluminumTin
6221BG
6221BG
THM,16555B REV D-G
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins1.180" (29.97mm)1.000" (25.40mm)-0.500" (12.70mm)---AluminumBlack Anodized
CE-OMNI-38
CE-OMNI-38
HEATSINK CER TO-220 TO-247
Wakefield-Vette
Tray ActiveBoard Level, VerticalTO-220, TO-247Solderable FeetRectangular, Fins0.803" (20.40mm)1.339" (34.00mm)-1.512" (38.40mm)-3.80°C/W @ 200 LFM7.00°C/WCeramic-
OMNI-UNI-40-50-D
OMNI-UNI-40-50-D
HEATSINK TO-247 TO-264 TO-220
Wakefield-Vette
OmniKlip™ Bulk ActiveBoard Level, VerticalTO-220, TO-247, TO-264Clip, Solder FootRectangular, Fins1.969" (50.00mm)1.575" (40.00mm)-2.953" (75.00mm)---AluminumBlack Anodized
609-50ABS3
609-50ABS3
HEATSINK FOR POWERPC CPU BLK
Wakefield-Vette
609 Bulk ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Clip, Thermal MaterialRectangular, Pin Fins2.895" (73.53mm)2.000" (50.80mm)-0.500" (12.70mm)-2.50°C/W @ 250 LFM-AluminumBlack Anodized