Thermal - Heat Sinks
113301 Items
PDF Mfr Part # RFQ Series Packaging Product StatusTypePackage CooledAttachment MethodShapeLengthWidthDiameterFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterialMaterial Finish
APF19-19-06CB
APF19-19-06CB
HEATSINK LOW-PROFILE FORGED
CTS Thermal Management Products
APF Box ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Thermal Tape, Adhesive (Not Included)Square, Fins0.748" (19.00mm)0.748" (19.00mm)-0.250" (6.35mm)-7.10°C/W @ 200 LFM-AluminumBlack Anodized
ATS-CPX045045020-119-C2-R0
ATS-CPX045045020-119-C2-R0
HEATSINK 45X45X20MM XCUT CP
Advanced Thermal Solutions Inc.
pushPIN™ Bulk ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Push PinSquare, Fins1.772" (45.00mm)1.772" (45.00mm)-0.790" (20.00mm)-4.68°C/W @ 100 LFM-AluminumBlue Anodized
7-338-4PP-BA
7-338-4PP-BA
HEATSINK PWR W/PINS BLACK TO-220
CTS Thermal Management Products
7 Box ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins2.500" (63.50mm)1.380" (35.05mm)-0.500" (12.70mm)9.0W @ 40°C-5.70°C/WAluminumBlack Anodized
D10650-40
D10650-40
HEATSINK 100PQFP COMPOSITE
Wakefield-Vette
Deltem™ Tube ActiveTop MountBGAThermal Tape, Adhesive (Not Included)Square, Pin Fins0.650" (16.51mm)0.650" (16.51mm)-0.400" (10.16mm)2.0W @ 40°C25.00°C/W @ 350 LFM-Composite-
960-19-15-F-AB-0
960-19-15-F-AB-0
HEATSINK 19X15MM FRONT PUSH PIN
Wakefield-Vette
960 Box ActiveTop MountBGAPush PinSquare, Pin Fins0.748" (19.00mm)0.748" (19.00mm)-0.590" (15.00mm)-6.80°C/W @ 200 LFM-AluminumBlack Anodized
6238B-MTG
6238B-MTG
BOARD LEVEL HEATSINK .61" TO-220
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard Level, VerticalTO-220Clip and PC PinRectangular, Fins1.159" (29.44mm)1.005" (25.53mm)-0.610" (15.49mm)2.0W @ 40°C6.00°C/W @ 600 LFM13.60°C/WAluminumBlack Anodized
VXA-55-101E
VXA-55-101E
EXTRUDED HEATSINK ANODIZED 55MM
Ohmite
VX Box ActiveBoard LevelSOT-227Bolt OnRectangular, Angled Fins1.917" (48.70mm)2.165" (55.00mm)-1.181" (30.00mm)---AluminumBlack Anodized
ATS-FPX050050025-15-C1-R0
ATS-FPX050050025-15-C1-R0
HEATSINK 50X50X25MM XCUT FP
Advanced Thermal Solutions Inc.
pushPIN™ Tray ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Push PinSquare, Fins1.969" (50.00mm)1.969" (50.00mm)-0.984" (25.00mm)-7.42°C/W @ 100 LFM-AluminumBlue Anodized
PA-T2X-38E
PA-T2X-38E
PIN FIN HEATSINK
Ohmite
P Box ActiveBoard Level, VerticalTO-220, TO-247, TO-264Clip and PC PinRectangular, Pin Fins1.180" (29.97mm)0.690" (17.53mm)-1.500" (38.10mm)--7.46°C/WAluminumBlack Anodized
513202B02500G
513202B02500G
HEAT SINK
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins2.000" (50.80mm)1.375" (34.93mm)-0.500" (12.70mm)2.0W @ 20°C3.00°C/W @ 400 LFM9.00°C/WAluminumBlack Anodized
678-39-S
678-39-S
HEATSINK TO-220/TO-247 SCREW
Wakefield-Vette
678 Box ActiveBoard Level, VerticalAssorted (BGA, LGA, CPU, ASIC...)Bolt On and Board MountsRectangular, Fins2.362" (60.00mm)0.984" (25.00mm)-1.520" (38.61mm)-0.60°C/W @ 600 LFM-AluminumBlack Anodized
BDN18-3CB/A01
BDN18-3CB/A01
HEATSINK CPU W/ADHESIVE 1.81"SQ
CTS Thermal Management Products
BDN Box ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Thermal Tape, Adhesive (Included)Square, Pin Fins1.810" (45.97mm)1.810" (45.97mm)-0.355" (9.02mm)-3.50°C/W @ 400 LFM10.80°C/WAluminumBlack Anodized
7022B-MTG
7022B-MTG
HEATSINK TO-220 TAB FOLD 55.12MM
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins1.968" (49.99mm)1.986" (50.44mm)-0.375" (9.52mm)10.0W @ 70°C1.75°C/W @ 800 LFM6.50°C/WAluminumBlack Anodized
532702B02500G
532702B02500G
HEATSINK TO-220 SOLDERPIN 50.8MM
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins2.000" (50.80mm)1.650" (41.91mm)-1.000" (25.40mm)10.0W @ 50°C2.00°C/W @ 300 LFM4.80°C/WAluminumBlack Anodized
ATS-CPX040040035-186-C2-R0
ATS-CPX040040035-186-C2-R0
HEATSINK 40X40X35MM R-TAB CP
Advanced Thermal Solutions Inc.
pushPIN™ Bulk ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Push PinSquare, Fins1.575" (40.00mm)1.575" (40.00mm)-1.378" (35.00mm)-2.80°C/W @ 100 LFM-AluminumBlue Anodized
ATS-FPX050050025-15-C2-R0
ATS-FPX050050025-15-C2-R0
HEATSINK 50X50X25MM XCUT FP
Advanced Thermal Solutions Inc.
pushPIN™ Bulk ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Push PinSquare, Fins1.969" (50.00mm)1.969" (50.00mm)-0.984" (25.00mm)-7.44°C/W @ 100 LFM-AluminumBlue Anodized
APF30-30-13CB
APF30-30-13CB
HEATSINK LOW-PROFILE FORGED
CTS Thermal Management Products
APF Box ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Thermal Tape, Adhesive (Not Included)Square, Fins1.181" (30.00mm)1.181" (30.00mm)-0.500" (12.70mm)-2.50°C/W @ 200 LFM-AluminumBlack Anodized
C220-050-2AE
C220-050-2AE
HEATSINK AND CLIPS FOR 2 TO-220
Ohmite
C Box ActiveBoard Level, VerticalTO-2202 Clips and PC PinRectangular, Fins1.969" (50.00mm)1.500" (38.10mm)-0.710" (18.03mm)---AluminumBlack Anodized
C247-050-2VE
C247-050-2VE
HEATSINK FOR TO-247 WITH 2 CLIPS
Ohmite
C Box ActiveBoard Level, VerticalTO-2472 Clips and PC PinRectangular, Fins1.969" (50.00mm)1.500" (38.10mm)-0.710" (18.03mm)2.5W @ 30°C5.00°C/W @ 200 LFM-AluminumDegreased
563002D00000G
563002D00000G
HEATSINK TO-220 TAB TIN
Aavid, Thermal Division of Boyd Corporation
Bulk ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins1.180" (29.97mm)1.000" (25.40mm)-0.500" (12.70mm)1.0W @ 20°C4.00°C/W @ 600 LFM13.00°C/W-Tin