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Thermal - Heat Sinks

113301 Items

Mfr Part #	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
E3A-T220-25E BLACK ANODIZED HEATSINK Ohmite	EX	Bulk	Active	Board Level	Bridge Rectifiers	Bolt On	Square, Fins	1.000" (25.40mm)	1.000" (25.40mm)	-	1.000" (25.40mm)	-	-	12.40°C/W	Aluminum	Black Anodized
ATS-PCB1047 HEATSINK TO-218/TO-247 W/TAB Advanced Thermal Solutions Inc.		Bulk	Active	Board Level, Vertical	TO-218, TO-247	Bolt On and Board Mounts	Rectangular, Fins	1.819" (46.20mm)	2.010" (51.00mm)	-	0.748" (19.00mm)	-	2.40°C/W @ 200 LFM	8.00°C/W	Aluminum	Black Anodized
6398BG HEATSINK TO-220 PIN BLACK Aavid, Thermal Division of Boyd Corporation		Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.500" (38.10mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	4.0W @ 30°C	2.00°C/W @ 400 LFM	4.40°C/W	Aluminum	Black Anodized
655-53AB HEATSINK CPU 40.6MM SQ H=.525" Wakefield-Vette	655	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.600" (40.64mm)	1.600" (40.64mm)	-	0.522" (13.27mm)	4.0W @ 40°C	2.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
HSB16-404018 HEAT SINK, BGA, 40 X 40 X 18 MM CUI Devices	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.709" (18.00mm)	9.4W @ 75°C	2.60°C/W @ 200 LFM	7.96°C/W	Aluminum Alloy	Black Anodized
DA-T268-301E-TR HEATSINK FOR TO-268 Ohmite	D	Tape & Reel (TR)	Active	Top Mount	TO-268 (D³Pak)	Solderable Feet	Rectangular, Fins	0.500" (12.70mm)	1.580" (40.13mm)	-	0.460" (11.68mm)	7.0W @ 35°C	4.00°C/W @ 700 LFM	-	Aluminum	Black Anodized
580100B00000G HEATSINK SLIDE-ON 8-DIP Aavid, Thermal Division of Boyd Corporation		Bulk	Active	Top Mount	8-DIP	Press Fit, Slide On	Rectangular, Fins	0.562" (14.27mm)	0.600" (15.24mm)	-	0.450" (11.43mm)	1.0W @ 30°C	8.00°C/W @ 500 LFM	30.00°C/W	Aluminum	Black Anodized
EA-T220-38E HEATSINK FOR TO-220 BLACK Ohmite	E	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.500" (38.10mm)	1.378" (35.00mm)	-	0.500" (12.70mm)	8.0W @ 80°C	4.00°C/W @ 300 LFM	10.40°C/W	Aluminum	Black Anodized
WV-T220-101E HEATSINK AND CLIP FOR TO-220 Ohmite	W	Tray	Active	Board Level, Vertical	TO-220	Clip and PC Pin	Rectangular, Fins	1.201" (30.50mm)	0.720" (18.29mm)	-	0.630" (16.00mm)	1.0W @ 20°C	-	13.00°C/W	Aluminum	Degreased
322605B00000G HEATSINK TO-5 1.25W H=.25" BLK Aavid, Thermal Division of Boyd Corporation		Bag	Active	Top Mount	TO-5	Press Fit	Cylindrical	-	-	0.315" (8.00mm) ID, 0.750" (19.05mm) OD	0.250" (6.35mm)	1.0W @ 60°C	25.00°C/W @ 200 LFM	54.00°C/W	Aluminum	Black Anodized
658-25ABT3 HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
530613B00000G HEATSINK TO-220 BLACK 1.18" Aavid, Thermal Division of Boyd Corporation		Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	4.0W @ 80°C	6.00°C/W @ 600 LFM	16.70°C/W	Aluminum	Black Anodized
E2A-T247-38E BLACK ANODIZED HEATSINK Ohmite	EX	Box	Active	Board Level, Vertical	TO-247	Bolt On and Board Mounts	Rectangular, Fins	0.641" (16.28mm)	0.642" (16.30mm)	-	1.500" (38.10mm)	4.0W @ 70°C	4.00°C/W @ 300 LFM	14.00°C/W	Aluminum	Black Anodized
577202B04000G HEATSINK TO-220 .500" COMPACT Aavid, Thermal Division of Boyd Corporation		Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.500" (12.70mm)	1.5W @ 40°C	10.00°C/W @ 200 LFM	24.40°C/W	Aluminum	Black Anodized
658-35ABT4E HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.350" (8.89mm)	-	3.00°C/W @ 800 LFM	-	Aluminum	Black Anodized
574502B03300G HEATSINK TO-220 VERT MNT W/TAB Aavid, Thermal Division of Boyd Corporation		Bulk	Active	Board Level, Vertical	TO-220	Clip and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.810" (20.57mm)	-	0.390" (9.91mm)	3.0W @ 60°C	6.00°C/W @ 600 LFM	21.20°C/W	Aluminum	Black Anodized
573400D00010G HEATSINK D-PAK3 TIN PLATED SMD Aavid, Thermal Division of Boyd Corporation		Tape & Reel (TR)	Active	Top Mount	TO-268 (D³Pak)	SMD Pad	Rectangular, Fins	0.500" (12.70mm)	1.220" (30.99mm)	-	0.401" (10.20mm)	1.0W @ 20°C	4.00°C/W @ 600 LFM	14.00°C/W	Copper	Tin
658-45ABT3 HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.450" (11.43mm)	3.0W @ 50°C	6.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
HSB17-404025 HEAT SINK, BGA, 40 X 40 X 25 MM CUI Devices	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.984" (25.00mm)	11.7W @ 75°C	2.10°C/W @ 200 LFM	6.41°C/W	Aluminum Alloy	Black Anodized
573902B00000G HEATSINK TO-220 BLACK CLIP-ON Aavid, Thermal Division of Boyd Corporation		Bulk	Active	Board Level	TO-220	Clip	Rectangular, Fins	1.500" (38.10mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	3.0W @ 60°C	7.00°C/W @ 200 LFM	18.80°C/W	Aluminum	Black Anodized