GoodChip

Solder

1543 Items

Mfr Part #	Series	Packaging	Product Status	Type	Composition	Diameter	Melting Point	Flux Type	Wire Gauge	Mesh Type	Process	Form	Shelf Life	Shelf Life Start	Storage/Refrigeration Temperature
RCBLF22701020P BLF227 ROSIN FLUX 1 LB. .020 DIA Canfield Technologies		Spool	Active	-	-	-	-	-	-	-	-	-	-	-	-
WC9601062PSAC SAC 305 WATER SOLUBLE FLUX 1 LB. Canfield Technologies		Spool	Active	-	-	-	-	-	-	-	-	-	-	-	-
RC9601062PSAC SAC 305 ROSIN FLUX 1 LB. 062 DIA Canfield Technologies		Spool	Active	-	-	-	-	-	-	-	-	-	-	-	-
CC9601031PAG3 SAC 305 NO CLEAN 1 LB. .031 DIA Canfield Technologies		Spool	Active	-	-	-	-	-	-	-	-	-	-	-	-
WC9601031P SAC 305 WATER SOLUBLE FLUX 1 LB. Canfield Technologies		Spool	Active	-	-	-	-	-	-	-	-	-	-	-	-
RC9601020CQPJ SAC 305 ROSIN FLUX 1 LB .020 DIA Canfield Technologies		Spool	Active	-	-	-	-	-	-	-	-	-	-	-	-
WC9601020P SAC 305 WATER SOLUBLE FLUX 1 LB. Canfield Technologies		Spool	Active	-	-	-	-	-	-	-	-	-	-	-	-
CC9601020ESAC SAC305 NO CLEAN FLUX 1 LB. .020 Canfield Technologies		Spool	Active	-	-	-	-	-	-	-	-	-	-	-	-
44-7340-0000 SOLDER BAR E-BAR 1.66LB Kester Solder		Bulk	Active	Bar Solder	Pb93.5Sn5Ag1.5 (93.5/5/1.5)	-	565 ~ 574°F (296 ~ 301°C)	-	-	-	Leaded	Bar, 1.66 lbs (750g)	-	-	-
JPAGSC1501P SIL CAN 15 BRAZING ALLOY Canfield Technologies		Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-
TS391AX THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc.		Bulk	Active	Solder Paste	Sn63Pb37 (63/37)	-	361°F (183°C)	No-Clean	-	4	Leaded	Syringe, 0.53 oz (15g), 5cc	12 Months	Date of Manufacture	68°F ~ 77°F (20°C ~ 25°C)
TS391LT THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc.		Bulk	Active	Solder Paste	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	-	281°F (138°C)	No-Clean	-	4	Lead Free	Syringe, 0.53 oz (15g), 5cc	12 Months	Date of Manufacture	68°F ~ 77°F (20°C ~ 25°C)
SMDIN52SN48 INDIUM SOLDER WIRE (IN52/SN48) 0 Chip Quik Inc.	SMD	Bulk	Active	Wire Solder	In52Sn48 (52/48)	0.031" (0.79mm)	244°F (118°C)	-	20 AWG, 21 SWG	-	Lead Free	Spool	-	-	-
SMD291AX10 SOLDER PASTE NO-CLEAN 63/37 10CC Chip Quik Inc.		Syringe	Active	Solder Paste	Sn63Pb37 (63/37)	-	361°F (183°C)	No-Clean	-	3	Leaded	Syringe, 1.23 oz (35g), 10cc	12 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)
SMD291SNL10 SOLDER PASTE NO-CLEAN 10CC SYR Chip Quik Inc.		Syringe	Active	Solder Paste	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	-	423 ~ 428°F (217 ~ 220°C)	No-Clean	-	3	Lead Free	Syringe, 1.23 oz (35g), 10cc	6 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)
SMDSWLF.020 4OZ SLD WIRE NO-CLEAN 96.5/3/.5 4OZ. Chip Quik Inc.		Spool	Active	Wire Solder	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.020" (0.51mm)	423 ~ 428°F (217 ~ 220°C)	No-Clean, Water Soluble	24 AWG, 25 SWG	-	Lead Free	Spool, 4 oz (113.40g)	-	-	-
SMDSWLTLFP32 SOLDER WIRE LOW TEMP 42/57/1 32' Chip Quik Inc.		Bulk	Active	Wire Solder	Bi57Sn42Ag1 (57/42/1)	0.030" (0.76mm)	281°F (138°C)	-	21 AWG, 22 SWG	-	Lead Free	-	-	-	-
SMD291AX250T3 SOLDER PASTE SN63/PB37 250G Chip Quik Inc.		Jar	Active	Solder Paste	Sn63Pb37 (63/37)	-	361°F (183°C)	No-Clean	-	3	Leaded	Jar, 8.8 oz (250g)	12 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)
SMDSWLF.008 50G LF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc.	SMD	Bulk	Active	Wire Solder	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.008" (0.20mm)	423 ~ 428°F (217 ~ 220°C)	No-Clean, Water Soluble	32 AWG, 35 SWG	-	Lead Free	Spool, 1.76 oz (50g)	-	-	-
NC2SWLF.031 0.5OZ LF SOLDER WIRE MINI POCKET PACK Chip Quik Inc.		Bulk	Active	Wire Solder	Sn99.3Cu0.7 (99.3/0.7)	0.031" (0.79mm)	441°F (227°C)	No-Clean	20 AWG, 21 SWG	-	-	Tube, 0.50 oz (14.17g)	-	-	-