PDF |
Mfr Part # |
RFQ |
Series |
Packaging |
Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature |
|
|
|
|
Bulk |
Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
|
|
|
Jar |
Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
|
|
CHIPQUIK® |
Bulk |
Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | - |
|
|
|
285 |
Bulk |
Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
|
|
|
Jar |
Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
|
|
|
Jar |
Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
|
|
48 |
Spool |
Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
|
|
SMD2 |
Bulk |
Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.012" (0.31mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
|
|
SMD |
Bulk |
Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 21 SWG | - | Leaded | Tube, 0.7 oz (19.85g) | - | - | - |
|
|
|
|
Bag |
Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.039" (0.99mm) | 440°F (227°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Tube, 0.71 oz (20g) | - | - | - |
|
|
|
|
Bulk |
Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Tube, 0.4 oz (11.34g) | - | - | - |
|
|
|
SMD2 |
Bulk |
Active | Wire Solder | Sn60Pb40 (60/40) | 0.020" (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Tube, 0.4 oz (11.34g) | - | - | - |
|
|
|
SMD |
Bulk |
Active | Solder Shot | Cu100(100) | - | 1983°F (1084°C) | - | - | - | Lead Free | Bag, 1 oz (28g) | - | - | - |
|
|
|
SMD |
Bulk |
Active | Solder Shot | Pb100(100) | - | 622°F (328°C) | - | - | - | Leaded | Bag, 1 oz (28g) | - | - | - |
|
|
|
SMD3 |
Bulk |
Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | 20 AWG, 21 SWG | - | Leaded | Tube, 0.7 oz (19.85g) | - | - | - |
|
|
|
SMD |
Bulk |
Active | Solder Shot | Sn100(100) | - | 450°F (232°C) | - | - | - | Lead Free | Bag, 1 oz (28g) | - | - | - |
|
|
|
SMD |
Bulk |
Active | Solder Shot | Bi100(100) | - | 521°F (271°C) | - | - | - | Lead Free | Bag, 1 oz (28g) | - | - | - |
|
|
|
|
Bulk |
Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Lead Free | Tube, 0.7 oz (19.85g) | - | - | - |
|
|
|
SMD3 |
Bulk |
Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Tube, 0.4 oz (11.34g) | - | - | - |
|
|
|
SMD |
Bulk |
Active | Solder Shot | Pb100(100) | - | 622°F (328°C) | - | - | - | Leaded | Bag, 1 lb (454g) | - | - | - |