| Mfr Part # | RFQ | Series | Packaging | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 3 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | |
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CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | |
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SMD | Bulk | Active | Ribbon Solder | In52Sn48 (52/48) | - | 244°F (118°C) | - | - | - | Lead Free | Spool | - | - | - | |
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CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | |
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Smooth Flow™ | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | |
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Super Low Dross™ | Bulk | Active | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | - | 441°F (227°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - | - | |
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Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032" (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - | ||
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SMD3 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - | |
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4900 | Spool | Active | Wire Solder | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | 0.032" (0.81mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 4 oz (113.40g) | 60 Months | - | 65°F ~ 80°F (18°C ~ 27°C) | |
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SUPER-PURE™ | Bag | Active | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | - | - | - | - | - | Lead Free | Bar, 1 lb (453.59g) | - | - | - | |
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Jar | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | ||
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285 | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | |
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Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - | ||
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4880 | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.040" (1.02mm) | 361°F (183°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - | - | |
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4870 | Spool | Active | Wire Solder | Sn60Pb40 (60/40) | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - | - | |
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4890 | Spool | Active | Wire Solder | Sn60Pb40 (60/40) | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - | - | |
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4860 | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032" (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - | - | |
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4880 | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032" (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - | - | |
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Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - | ||
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Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - |