Mfr Part # | RFQ | Series | Packaging | Product Status | Type | Pixel Size | Active Pixel Array | Frames per Second | Voltage - Supply | Package / Case | Supplier Device Package | Operating Temperature | |
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Tape & Reel (TR) | Active | 3D Time of Flight | 8µm x 8µm | 8H X 8V | 8000 | 8V ~ 9V | - | - | -40°C ~ 85°C | ||
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PYTHON | Tray | Active | CMOS | 4.8µm x 4.8µm | 808H x 608V | 120 | 1.7V ~ 1.9V, 3.2V ~ 3.4V | 67-WFBGA, CSPBGA | 67-ODCSP (4.93x6.13) | -40°C ~ 85°C (TJ) | |
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Bulk | Active | Thermal | - | 32H x 24V | - | 2.9V ~ 3.6V | TO-205AD, TO-39-3 Metal Can | TO-39 | -40°C ~ 85°C | ||
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Bulk | Active | Thermal | - | 32H x 24V | - | 2.9V ~ 3.6V | TO-205AD, TO-39-3 Metal Can | TO-39 | -40°C ~ 85°C | ||
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Mosaic Core | Box | Active | Thermal | 12µm x 12µm | 320H x 240V | 27 | 3.3V ~ 5V | Module | Module | -10°C ~ 60°C | |
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Mosaic Core | Box | Active | Thermal | 12µm x 12µm | 320H x 240V | 9 | 3.3V ~ 5V | Module | Module | -10°C ~ 60°C | |
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Tape & Reel (TR) | Active | 1D Time of Flight | - | - | - | 2.7V ~ 3.3V | 12-TFLGA Module | 12-OLGA (2.2x3.6) | -30°C ~ 70°C | ||
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CameraCubeChip™, OmniPixel3-HS™ | Tape & Reel (TR) | Active | CMOS with Processor | 1.75µm x 1.75µm | 640H x 480V | 30 | 2.8V | 25-CSP | - | -30°C ~ 70°C (TJ) | |
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CameraCubeChip™, OmniPixel3-HS™ | Tape & Reel (TR) | Active | CMOS with Processor | 1.75µm x 1.75µm | 640H x 480V | 30 | 2.8V | 25-CSP | - | -30°C ~ 70°C (TJ) | |
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Tray | Active | - | - | - | - | - | 52-LCC | 52-PLCC (12x12) | - | ||
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Tray | Last Time Buy | CMOS | 1.1µm x 1.1µm | 4208H x 3120V | 30 | - | 63-WFBGA, CSPBGA | 63-ODCSP (6.29x5.69) | - | ||
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Tray | Active | CMOS | 4.8µm x 4.8µm | 1280H x 1024V | 150 | 1.8V, 3.3V | 168-CPGA | 168-PGA | -40°C ~ 85°C (TJ) | ||
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Mosaic Core | Box | Active | Thermal | 12µm x 12µm | 320H x 240V | 27 | 3.3V ~ 5V | Module | Module | -10°C ~ 60°C | |
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Tray | Active | CMOS | 2.2µm x 2.2µm | 2304H x 1536V | 30 | 1.7V ~ 1.9V, 2.4V ~ 3.1V | 61-WFBGA, CSPBGA | 61-ODCSP (6.28x6.65) | -30°C ~ 70°C (TJ) | ||
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Automotive, AEC-Q100 | Tray | Active | CMOS | 3.75µm x 3.75µm | 1280H x 960V | 45 | 1.8V ~ 2.8V | 63-LBGA | 63-iBGA (9x9) | -40°C ~ 105°C (TA) | |
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Tray | Active | CMOS | 2.2µm x 2.2µm | 2592H x 1944V | 53 | 1.7V ~ 1.9V, 2.6V ~ 3.1V | 48-LCC | 48-iLCC (10x10) | -30°C ~ 70°C | ||
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Tray | Active | CMOS | 4.8µm x 4.8µm | 1280H x 1024V | 150 | 1.8V, 3.3V | 48-LCC | 48-LCC (14.22x14.22) | -40°C ~ 85°C (TJ) | ||
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Mosaic Core | Box | Active | Thermal | 12µm x 12µm | 200H x 150V | 9 | 3.3V ~ 5V | Module | Module | -10°C ~ 60°C | |
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Tray | Active | CMOS | 3µm x 3µm | 1928H x 1088V | 60 | 1.7V ~ 1.95V, 2.5V ~ 3.1V | 80-BGA | 80-IBGA (10x10) | -30°C ~ 85°C (TA) | ||
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Tape & Reel (TR) | Active | 1D Time of Flight | - | - | - | 2.7V ~ 3.3V | 12-TFLGA Module | 12-OLGA (2.2x3.6) | -30°C ~ 70°C |