608-CG1T

608-CG1T

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See Product Specifications

608-CG1T
Description:
CONN IC DIP SOCKET 8POS GOLD
Package:
Bulk
Datasheet:
608-CG1T Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:608-CG1T
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:TE Connectivity AMP Connectors
Packaging:Bulk
Product Status:Obsolete
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:-
Contact Material - Mating:-
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:-
Contact Material - Post:Phosphor Bronze
Housing Material:Thermoplastic, Polyester
Operating Temperature:-65°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
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