528-AG12D-LF

528-AG12D-LF

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See Product Specifications

528-AG12D-LF
Description:
CONN IC DIP SOCKET 28POS TIN
Package:
Bulk
Datasheet:
528-AG12D-LF Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:528-AG12D-LF
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:TE Connectivity AMP Connectors
Packaging:Bulk
Product Status:Obsolete
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:-
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:-
Contact Material - Post:Beryllium Copper
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:-55°C ~ 105°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
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Mill-Max Manufacturing Corp.
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Mill-Max Manufacturing Corp.
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