522-AG11D

522-AG11D

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522-AG11D
Description:
CONN IC DIP SOCKET 22POS GOLD
Package:
Bulk
Datasheet:
522-AG11D Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:522-AG11D
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:TE Connectivity AMP Connectors
Packaging:Bulk
Product Status:Active
Type:DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid):22 (2 x 11)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:25.0µin (0.63µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin-Lead
Contact Finish Thickness - Post:25.0µin (0.63µm)
Contact Material - Post:Brass, Copper
Housing Material:Polyester
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
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For Use With
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