508-AG10D-ES

508-AG10D-ES

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See Product Specifications

508-AG10D-ES
Description:
CONN IC DIP SOCKET 8POS GOLD
Package:
Bulk
Datasheet:
508-AG10D-ES Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:508-AG10D-ES
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:TE Connectivity AMP Connectors
Packaging:Bulk
Product Status:Obsolete
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:25.0µin (0.63µm)
Contact Material - Mating:Copper Alloy
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:25.0µin (0.63µm)
Contact Material - Post:Copper Alloy
Housing Material:Polyester
Operating Temperature:-55°C ~ 125°C
In Stock: 14
Stock:
14 Can Ship Immediately
  • Share:
For Use With
116-87-624-41-002101
116-87-624-41-002101
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116-83-650-41-018101
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Aries Electronics
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Mill-Max Manufacturing Corp.
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515-91-097-11-041001
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Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
515-93-120-13-061003
515-93-120-13-061003
Mill-Max Manufacturing Corp.
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551-10-273-21-125004
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Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
551-90-124-14-071004
551-90-124-14-071004
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
551-90-383-22-105004
551-90-383-22-105004
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
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