3-1825276-2

3-1825276-2

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3-1825276-2
Description:
CONN IC DIP SOCKET 32POS GOLD
Package:
Tray
Datasheet:
3-1825276-2 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:3-1825276-2
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:TE Connectivity AMP Connectors
Packaging:Tray
Product Status:Active
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):32 (2 x 16)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:30.0µin (0.76µm)
Contact Material - Post:Beryllium Copper
Housing Material:Thermoplastic, Glass Filled
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
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For Use With
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CONN HDR SOLDRTL
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