IC-316-SGG

IC-316-SGG

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IC-316-SGG
Mfr.:
Description:
CONN IC DIP SOCKET 16POS GOLD
Package:
Bulk
Datasheet:
IC-316-SGG Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:IC-316-SGG
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Samtec Inc.
Packaging:Bulk
Product Status:Obsolete
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):16 (2 x 8)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:30.0µin (0.76µm)
Contact Material - Post:Phosphor Bronze
Housing Material:Polyester, Glass Filled
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
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