558-10-500M30-001101

558-10-500M30-001101

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558-10-500M30-001101
Mfr.:
Description:
PGA SOLDER TAIL 1.27MM
Package:
Bulk
Datasheet:
558-10-500M30-001101 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:558-10-500M30-001101
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:PGA
Number of Positions or Pins (Grid):500 (30 x 30)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:FR4 Epoxy Glass
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
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