558-10-500M30-001101

558-10-500M30-001101

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558-10-500M30-001101
Mfr.:
Description:
PGA SOLDER TAIL 1.27MM
Package:
Bulk
Datasheet:
558-10-500M30-001101 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:558-10-500M30-001101
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:PGA
Number of Positions or Pins (Grid):500 (30 x 30)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:FR4 Epoxy Glass
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
110-47-324-41-001000
110-47-324-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 24POS GOLD
116-83-312-41-007101
116-83-312-41-007101
Preci-Dip
CONN IC DIP SOCKET 12POS GOLD
346-43-135-41-013000
346-43-135-41-013000
Mill-Max Manufacturing Corp.
CONN SOCKET SIP 35POS GOLD
18-6501-30
18-6501-30
Aries Electronics
CONN IC DIP SOCKET 18POS TIN
09-7325-10
09-7325-10
Aries Electronics
CONN SOCKET SIP 9POS TIN
614-43-318-31-007000
614-43-318-31-007000
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
111-41-652-41-001000
111-41-652-41-001000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
110-93-422-61-001000
110-93-422-61-001000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
SIP050-1X27-160BLF
SIP050-1X27-160BLF
Amphenol ICC (FCI)
CONN SOCKET SIP 27POS GOLD
CUSTOM BGA
CUSTOM BGA
3M
CONN SOCKET BGA CUSTOM
511-93-400-20-000003
511-93-400-20-000003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
515-93-100-13-062001
515-93-100-13-062001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
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