558-10-480M29-001101

558-10-480M29-001101

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558-10-480M29-001101
Mfr.:
Description:
PGA SOLDER TAIL 1.27MM
Package:
Bulk
Datasheet:
558-10-480M29-001101 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:558-10-480M29-001101
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:PGA
Number of Positions or Pins (Grid):480 (29 x 29)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:FR4 Epoxy Glass
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
116-87-642-41-018101
116-87-642-41-018101
Preci-Dip
CONN IC DIP SOCKET 42POS GOLD
124-83-428-41-002101
124-83-428-41-002101
Preci-Dip
CONN IC DIP SOCKET 28POS GOLD
22-1518-11H
22-1518-11H
Aries Electronics
CONN IC DIP SOCKET 22POS GOLD
126-93-304-41-002000
126-93-304-41-002000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 4POS GOLD
XR2A-6411-N
XR2A-6411-N
Omron Electronics Inc-EMC Div
I.C. CONNECTOR SOCKET
614-91-310-31-012000
614-91-310-31-012000
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
28-C300-00
28-C300-00
Aries Electronics
CONN IC DIP SOCKET 28POS GOLD
44-3553-10
44-3553-10
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS TIN
558-10-272M20-001104
558-10-272M20-001104
Preci-Dip
BGA SURFACE MOUNT 1.27MM
SIP050-1X32-157BLF
SIP050-1X32-157BLF
Amphenol ICC (FCI)
CONN SOCKET SIP 32POS TIN
511-13-072-11-061002
511-13-072-11-061002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
515-13-081-09-000001
515-13-081-09-000001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
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