558-10-478M26-131104

558-10-478M26-131104

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558-10-478M26-131104
Mfr.:
Description:
BGA SURFACE MOUNT 1.27MM
Package:
Bulk
Datasheet:
558-10-478M26-131104 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:558-10-478M26-131104
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:BGA
Number of Positions or Pins (Grid):478 (26 x 26)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Brass
Mounting Type:Surface Mount
Features:Open Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:FR4 Epoxy Glass
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
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For Use With
115-93-328-41-001000
115-93-328-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 28POS GOLD
115-83-306-41-001101
115-83-306-41-001101
Preci-Dip
CONN IC DIP SOCKET 6POS GOLD
510-87-085-11-045101
510-87-085-11-045101
Preci-Dip
CONN SOCKET PGA 85POS GOLD
64-9518-10
64-9518-10
Aries Electronics
CONN IC DIP SOCKET 64POS GOLD
20-7435-10
20-7435-10
Aries Electronics
CONN SOCKET SIP 20POS TIN
123-93-322-41-001000
123-93-322-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 22POS GOLD
126-93-952-41-001000
126-93-952-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 52POS GOLD
42-6573-11
42-6573-11
Aries Electronics
CONN IC DIP SOCKET ZIF 42POS TIN
510-13-145-17-001003
510-13-145-17-001003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
20-7XXXX-10
20-7XXXX-10
Aries Electronics
CONN SOCKET SIP 20POS TIN
511-93-121-13-061003
511-93-121-13-061003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
551-90-144-15-082003
551-90-144-15-082003
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
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