558-10-400M20-000104

558-10-400M20-000104

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558-10-400M20-000104
Mfr.:
Description:
BGA SURFACE MOUNT 1.27MM
Package:
Bulk
Datasheet:
558-10-400M20-000104 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:558-10-400M20-000104
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:BGA
Number of Positions or Pins (Grid):400 (20 x 20)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Brass
Mounting Type:Surface Mount
Features:Closed Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:FR4 Epoxy Glass
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
714-43-164-31-018000
714-43-164-31-018000
Mill-Max Manufacturing Corp.
CONN SOCKET SIP 64POS GOLD
116-87-642-41-018101
116-87-642-41-018101
Preci-Dip
CONN IC DIP SOCKET 42POS GOLD
116-43-304-61-003000
116-43-304-61-003000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
110-91-320-41-105000
110-91-320-41-105000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
110-47-624-41-105000
110-47-624-41-105000
Mill-Max Manufacturing Corp.
STANDRD SOLDRTL
127-93-628-41-002000
127-93-628-41-002000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 28POS GOLD
124-93-328-41-002000
124-93-328-41-002000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 28POS GOLD
14-3508-212
14-3508-212
Aries Electronics
CONN IC DIP SOCKET 14POS GOLD
3-1571586-0
3-1571586-0
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 32POS GOLD
511-91-153-15-061003
511-91-153-15-061003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
511-91-289-17-000001
511-91-289-17-000001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
551-90-120-13-061005
551-90-120-13-061005
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
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