558-10-357M19-001104

558-10-357M19-001104

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558-10-357M19-001104
Mfr.:
Description:
BGA SURFACE MOUNT 1.27MM
Package:
Bulk
Datasheet:
558-10-357M19-001104 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:558-10-357M19-001104
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:BGA
Number of Positions or Pins (Grid):357 (19 x 19)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Brass
Mounting Type:Surface Mount
Features:Closed Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:FR4 Epoxy Glass
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
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