550-80-381-18-101135

550-80-381-18-101135

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See Product Specifications

550-80-381-18-101135
Mfr.:
Description:
PGA SOLDER TAIL
Package:
Bulk
Datasheet:
550-80-381-18-101135 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:550-80-381-18-101135
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:PGA
Number of Positions or Pins (Grid):381 (18 x 18)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:-
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:-
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
117-83-668-41-005101
117-83-668-41-005101
Preci-Dip
CONN IC DIP SOCKET 68POS GOLD
08-71000-10
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18-3518-112
18-3518-112
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CONN IC DIP SOCKET 18POS GOLD
14-8600-310C
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CONN IC DIP SOCKET 20POS GOLD
612-43-420-41-001000
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Mill-Max Manufacturing Corp.
SKT CARRIER SOLDRTL
110-44-210-61-001000
110-44-210-61-001000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
111-43-952-61-001000
111-43-952-61-001000
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CONN IC SKT DBL
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Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
522-93-135-14-051003
522-93-135-14-051003
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
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