550-10-600M35-001166

550-10-600M35-001166

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550-10-600M35-001166
Mfr.:
Description:
BGA PIN ADAPTER 1.27MM SMD
Package:
Bulk
Datasheet:
550-10-600M35-001166 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:550-10-600M35-001166
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:BGA
Number of Positions or Pins (Grid):600 (35 x 35)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:FR4 Epoxy Glass
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
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XR2T-2021-N
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Omron Electronics Inc-EMC Div
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38-3513-11
38-3513-11
Aries Electronics
CONN IC DIP SOCKET 38POS GOLD
614-91-308-41-001000
614-91-308-41-001000
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
20-81250-610C
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CONN IC DIP SOCKET 20POS GOLD
116-93-640-41-006000
116-93-640-41-006000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 40POS GOLD
510-93-169-17-101001
510-93-169-17-101001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
110-024-050
110-024-050
3M
CONN IC DIP SOCKET 24POS GOLD
511-93-144-12-000003
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Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
515-91-085-10-031001
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SKT PGA SOLDRTL
515-93-084-13-081001
515-93-084-13-081001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
522-13-153-15-061001
522-13-153-15-061001
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
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BGA SURFACE MOUNT 1.27MM