550-10-456M26-001152

550-10-456M26-001152

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550-10-456M26-001152
Mfr.:
Description:
BGA SOLDER TAIL
Package:
Bulk
Datasheet:
550-10-456M26-001152 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:550-10-456M26-001152
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:BGA
Number of Positions or Pins (Grid):456 (26 x 26)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Brass
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:FR4 Epoxy Glass
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
XR2P1041
XR2P1041
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 10POS GOLD
114-47-324-41-117000
114-47-324-41-117000
Mill-Max Manufacturing Corp.
STANDRD SOLDRTL DBL SKT
16-7980-10
16-7980-10
Aries Electronics
CONN SOCKET SIP 16POS TIN
612-41-318-41-003000
612-41-318-41-003000
Mill-Max Manufacturing Corp.
SKT CARRIER SOLDRTL
115-41-648-41-003000
115-41-648-41-003000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
110-41-324-61-001000
110-41-324-61-001000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
40-6556-20
40-6556-20
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
SIP1X02-041BLF
SIP1X02-041BLF
Amphenol ICC (FCI)
CONN SOCKET SIP 2POS GOLD
511-91-361-19-000003
511-91-361-19-000003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
522-93-049-07-000001
522-93-049-07-000001
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
523-13-124-13-041003
523-13-124-13-041003
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
523-13-153-15-061002
523-13-153-15-061002
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
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