550-10-420M26-001152

550-10-420M26-001152

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550-10-420M26-001152
Mfr.:
Description:
BGA SOLDER TAIL
Package:
Bulk
Datasheet:
550-10-420M26-001152 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:550-10-420M26-001152
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:BGA
Number of Positions or Pins (Grid):420 (26 x 26)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Brass
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:FR4 Epoxy Glass
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
114-87-308-41-134161
114-87-308-41-134161
Preci-Dip
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110-83-318-41-530000
110-83-318-41-530000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
14-3518-10H
14-3518-10H
Aries Electronics
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16-6513-10
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14-810-90RWR
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16-0501-30
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Aries Electronics
CONN SOCKET SIP 16POS TIN
111-43-648-41-001000
111-43-648-41-001000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
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126-93-640-41-002000
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68-PGM11032-10T
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3M
CONN IC DIP SOCKET 42POS GOLD
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515-91-153-15-061003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
523-93-036-06-000002
523-93-036-06-000002
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
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