550-10-420M26-001152

550-10-420M26-001152

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550-10-420M26-001152
Mfr.:
Description:
BGA SOLDER TAIL
Package:
Bulk
Datasheet:
550-10-420M26-001152 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:550-10-420M26-001152
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:BGA
Number of Positions or Pins (Grid):420 (26 x 26)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Brass
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:FR4 Epoxy Glass
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
06-0503-30
06-0503-30
Aries Electronics
CONN SOCKET SIP 6POS GOLD
124-83-424-41-002101
124-83-424-41-002101
Preci-Dip
CONN IC DIP SOCKET 24POS GOLD
22-6513-10
22-6513-10
Aries Electronics
CONN IC DIP SOCKET 22POS GOLD
117-43-640-41-005000
117-43-640-41-005000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 40POS GOLD
06-823-90C
06-823-90C
Aries Electronics
CONN IC DIP SOCKET 6POS GOLD
24-1508-31
24-1508-31
Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
110-43-320-61-801000
110-43-320-61-801000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
510-93-056-09-041001
510-93-056-09-041001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
SIP050-1X13-157BLF
SIP050-1X13-157BLF
Amphenol ICC (FCI)
CONN SOCKET SIP 13POS TIN
511-93-101-13-061002
511-93-101-13-061002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
522-13-084-11-045003
522-13-084-11-045003
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
551-90-072-11-061003
551-90-072-11-061003
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
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