550-10-255M16-001152

550-10-255M16-001152

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See Product Specifications

550-10-255M16-001152
Mfr.:
Description:
BGA SOLDER TAIL
Package:
Bulk
Datasheet:
550-10-255M16-001152 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:550-10-255M16-001152
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:BGA
Number of Positions or Pins (Grid):255 (16 x 16)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Brass
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:FR4 Epoxy Glass
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
NTE417
NTE417
NTE Electronics, Inc
SOCKET-3-PIN TO-18
111-43-316-41-001000
111-43-316-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 16POS GOLD
01-0503-21
01-0503-21
Aries Electronics
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116-83-320-41-018101
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Preci-Dip
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Mill-Max Manufacturing Corp.
STANDRD SOLDRTL DBL SKT
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Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
614-13-241-18-075001
614-13-241-18-075001
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
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