550-10-192M16-001152

550-10-192M16-001152

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See Product Specifications

550-10-192M16-001152
Mfr.:
Description:
BGA SOLDER TAIL
Package:
Bulk
Datasheet:
550-10-192M16-001152 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:550-10-192M16-001152
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:BGA
Number of Positions or Pins (Grid):192 (16 x 16)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Brass
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:FR4 Epoxy Glass
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
116-83-322-41-003101
116-83-322-41-003101
Preci-Dip
CONN IC DIP SOCKET 22POS GOLD
917-43-210-41-001000
917-43-210-41-001000
Mill-Max Manufacturing Corp.
CONN SOCKET TRANSIST TO100 10POS
299-87-316-11-001101
299-87-316-11-001101
Preci-Dip
CONN IC DIP SOCKET 16POS GOLD
XR2T2411N
XR2T2411N
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 24POS GOLD
612-91-432-41-003000
612-91-432-41-003000
Mill-Max Manufacturing Corp.
SKT CARRIER SOLDRTL
116-47-650-41-006000
116-47-650-41-006000
Mill-Max Manufacturing Corp.
STANDRD SOLDRTL
180-PGM18007-41
180-PGM18007-41
Aries Electronics
CONN SOCKET PGA GOLD
36-6551-16
36-6551-16
Aries Electronics
CONN IC DIP SOCKET ZIF 36POS
101-93-324-41-560000
101-93-324-41-560000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 24POS GOLD
1109927-48
1109927-48
Aries Electronics
SER X55X UNIV ZIF DIP TST SCKT
515-13-224-18-095003
515-13-224-18-095003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
614-93-144-15-082007
614-93-144-15-082007
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
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