514-87-360M19-001148

514-87-360M19-001148

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514-87-360M19-001148
Mfr.:
Description:
CONN SOCKET BGA 360POS GOLD
Package:
Bulk
Datasheet:
514-87-360M19-001148 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:514-87-360M19-001148
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:BGA
Number of Positions or Pins (Grid):360 (19 x 19)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:Flash
Contact Material - Mating:Beryllium Copper
Mounting Type:Surface Mount
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:-
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
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