117-83-628-41-005101

117-83-628-41-005101

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117-83-628-41-005101
Mfr.:
Description:
CONN IC DIP SOCKET 28POS GOLD
Package:
Bulk
Datasheet:
117-83-628-41-005101 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:117-83-628-41-005101
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Preci-Dip
Packaging:Bulk
Product Status:Active
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.070" (1.78mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:29.5µin (0.75µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.070" (1.78mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:-
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
614-91-304-31-012000
614-91-304-31-012000
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
16-6823-90T
16-6823-90T
Aries Electronics
CONN IC DIP SOCKET 16POS TIN
612-91-314-41-001000
612-91-314-41-001000
Mill-Max Manufacturing Corp.
SKT CARRIER SOLDRTL
104-13-316-41-780000
104-13-316-41-780000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 16POS GOLD
612-41-652-41-001000
612-41-652-41-001000
Mill-Max Manufacturing Corp.
SKT CARRIER SOLDRTL
30-0508-31
30-0508-31
Aries Electronics
CONN SOCKET SIP 30POS GOLD
28-3508-31
28-3508-31
Aries Electronics
CONN IC DIP SOCKET 28POS GOLD
SIP1X20-001BLF
SIP1X20-001BLF
Amphenol ICC (FCI)
CONN SOCKET SIP 20POS GOLD
100-014-050
100-014-050
3M
CONN IC DIP SOCKET 14POS GOLD
511-91-089-12-051002
511-91-089-12-051002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
515-93-153-15-061003
515-93-153-15-061003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
515-93-223-18-098003
515-93-223-18-098003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
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