XR2C-2002

XR2C-2002

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See Product Specifications

XR2C-2002
Description:
CONN SOCKET SIP 20POS GOLD
Package:
Bulk
Datasheet:
XR2C-2002 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:XR2C-2002
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Omron Electronics Inc-EMC Div
Packaging:Bulk
Product Status:Active
Type:SIP
Number of Positions or Pins (Grid):20 (1 x 20)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Wire Wrap
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:30.0µin (0.76µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
116-87-636-41-018101
116-87-636-41-018101
Preci-Dip
CONN IC DIP SOCKET 36POS GOLD
APA-314-G-M
APA-314-G-M
Samtec Inc.
ADAPTER PLUG
110-99-636-41-001000
110-99-636-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 36POS TINLEAD
116-93-628-41-001000
116-93-628-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 28POS GOLD
30-8940-310C
30-8940-310C
Aries Electronics
CONN IC DIP SOCKET 30POS GOLD
510-91-173-16-005003
510-91-173-16-005003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
558-10-652M35-001104
558-10-652M35-001104
Preci-Dip
BGA SURFACE MOUNT 1.27MM
511-91-073-11-061001
511-91-073-11-061001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
511-93-059-11-001002
511-93-059-11-001002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
515-91-068-10-041001
515-91-068-10-041001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
522-13-155-18-121001
522-13-155-18-121001
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
523-93-145-13-041002
523-93-145-13-041002
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
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