XR2A-0811-N

XR2A-0811-N

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XR2A-0811-N
Description:
CONN IC DIP SOCKET 8POS GOLD
Package:
Bulk
Datasheet:
XR2A-0811-N Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:XR2A-0811-N
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Omron Electronics Inc-EMC Div
Packaging:Bulk
Product Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
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