OM13497UL

OM13497UL

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See Product Specifications

OM13497UL
Mfr.:
Description:
SURFACE MOUNT TO DIP EVALUATION
Package:
Bulk
Datasheet:
OM13497UL Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:OM13497UL
Category:Kits
Subcategory:Prototyping Boards, Fabrication Kits
Manufacturer:NXP USA Inc.
Packaging:Bulk
Product Status:Active
Kit Type:Adapter, Breakout Boards
Quantity:18 Pieces (3 Values - 6 Each)
Package Accepted:HTSSOP, VFBGA, XFBGA
Specifications:SMD to DIP
Number of Positions:24
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
BUNDLE STEAM STARTER
BUNDLE STEAM STARTER
Gearbox Labs
BUNDLE STEAM ED STARTING KIT-CUR
BN1013
BN1013
Bantam Tools
PROTOTYPING BUNDLE
WORKSHOP VIRTUAL LED 8X8 MATRIX
WORKSHOP VIRTUAL LED 8X8 MATRIX
Gearbox Labs
WORKSHOP LED MATRIX
WORKSHOP VIRTUAL IOT ESP32 INTRO WI-FI
WORKSHOP VIRTUAL IOT ESP32 INTRO WI-FI
Gearbox Labs
WORKSHOP ESP32 INTRO IOT WIFI
KIT SCIENCE BOAT
KIT SCIENCE BOAT
Gearbox Labs
KIT SCIENCE BOAT
WORKSHOP VIRTUAL WATER CYCLE
WORKSHOP VIRTUAL WATER CYCLE
Gearbox Labs
WORKSHOP WATER CYCLE
BUNDLE IOT STATION
BUNDLE IOT STATION
Gearbox Labs
BUNDLE IOT STATION
BUNDLE STEAM CLASSROOM STARTER
BUNDLE STEAM CLASSROOM STARTER
Gearbox Labs
CLASSROOM BUNDLE-STARTER CUR KIT
ADAPT_COMBO
ADAPT_COMBO
Chip Quik Inc.
SMT ADAPTER VALUE PACK
OM13493UL
OM13493UL
NXP USA Inc.
SURFACE MOUNT TO DIP EVALUATION
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OM13491UL
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SURFACE MOUNT TO DIP EVALUATION
OM13497UL
OM13497UL
NXP USA Inc.
SURFACE MOUNT TO DIP EVALUATION
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