OM13497UL

OM13497UL

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OM13497UL
Mfr.:
Description:
SURFACE MOUNT TO DIP EVALUATION
Package:
Bulk
Datasheet:
OM13497UL Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:OM13497UL
Category:Kits
Subcategory:Prototyping Boards, Fabrication Kits
Manufacturer:NXP USA Inc.
Packaging:Bulk
Product Status:Active
Kit Type:Adapter, Breakout Boards
Quantity:18 Pieces (3 Values - 6 Each)
Package Accepted:HTSSOP, VFBGA, XFBGA
Specifications:SMD to DIP
Number of Positions:24
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
GUIDE CODING FOR UNO AND ESP32
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CODING GUIDE UNO-ESP32
WORKSHOP VIRTUAL ENGINEERING AND CODING ADV
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ONLINE WORKSHOP SERIES-ADV TC
BN1013
BN1013
Bantam Tools
PROTOTYPING BUNDLE
MINI KIT SOUND
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MINI KIT SOUND
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PROTOKIT ULTRA PACKAGE
KIT SCIENCE BOAT
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KIT SCIENCE BOAT
BUNDLE IOT STATION
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BUNDLE IOT STATION
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BUNDLE STEAM CLASSROOM STATION
Gearbox Labs
CLASSROOM BUNDLE-STEAM ED KITCUR
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