1051420133

1051420133

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See Product Specifications

1051420133
Mfr.:
Description:
CONN SOCKET LGA 2011POS GOLD
Package:
Tray
Datasheet:
1051420133 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:1051420133
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Molex
Packaging:Tray
Product Status:Obsolete
Type:LGA
Number of Positions or Pins (Grid):2011 (47 x 58)
Pitch - Mating:0.040" (1.02mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Copper Alloy
Mounting Type:Surface Mount
Features:Open Frame
Termination:Solder
Pitch - Post:0.040" (1.01mm)
Contact Finish - Post:-
Contact Finish Thickness - Post:-
Contact Material - Post:-
Housing Material:Thermoplastic
Operating Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
540-AG11D-ES
540-AG11D-ES
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 40POS GOLD
216-7383-55-1902
216-7383-55-1902
3M
CONN SOCKET SOIC 16POS GOLD
917-83-208-41-053101
917-83-208-41-053101
Preci-Dip
CONN TRANSIST TO-5 8POS GOLD
117-87-432-41-105101
117-87-432-41-105101
Preci-Dip
CONN IC DIP SOCKET 32POS GOLD
116-83-422-41-009101
116-83-422-41-009101
Preci-Dip
CONN IC DIP SOCKET 22POS GOLD
299-87-630-10-002101
299-87-630-10-002101
Preci-Dip
CONN IC DIP SOCKET 30POS GOLD
614-91-310-31-012000
614-91-310-31-012000
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
510-43-169-17-101002
510-43-169-17-101002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
100-028-051
100-028-051
3M
CONN IC DIP SOCKET 28POS GOLD
1571550-7
1571550-7
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 22POS TIN
522-13-179-18-117003
522-13-179-18-117003
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
551-90-155-16-003005
551-90-155-16-003005
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
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