714-43-230-31-018000

714-43-230-31-018000

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714-43-230-31-018000
Description:
CONN IC DIP SOCKET 30POS GOLD
Package:
Bulk
Datasheet:
714-43-230-31-018000 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:714-43-230-31-018000
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Mill-Max Manufacturing Corp.
Packaging:Bulk
Product Status:Active
Type:DIP, 0.1" (2.54mm) Row Spacing
Number of Positions or Pins (Grid):30 (2 x 15)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Carrier, Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:30.0µin (0.76µm)
Contact Material - Post:Brass Alloy
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
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For Use With
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