299-93-630-10-002000

299-93-630-10-002000

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299-93-630-10-002000
Description:
CONN IC DIP SOCKET 30POS GOLD
Package:
Tube
Datasheet:
299-93-630-10-002000 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:299-93-630-10-002000
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Mill-Max Manufacturing Corp.
Packaging:Tube
Product Status:Active
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):30 (2 x 15)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole, Right Angle, Horizontal
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin-Lead
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass Alloy
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:-55°C ~ 125°C
In Stock: 50
Stock:
50 Can Ship Immediately
  • Share:
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